2000
DOI: 10.1002/(sici)1097-4628(20000523)76:8<1315::aid-app12>3.0.co;2-4
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Water-sorption behavior ofP-phenylene diamine-based polyimide thin films

Abstract: Four different p‐PDA–based polyimide thin films were prepared from their respective poly(amic acid)s through thermal imidization at 400°C: poly(p‐phenylene pyromellitimide) (PMDA‐PDA); poly(p‐phenylene biphenyltetra carboximide) (BPDA‐PDA); poly(p‐phenylene 3,3′,4,4′‐oxydiphthalimide) (ODPA‐PDA); and poly(p‐phenylene 4,4′‐hexafluoroisopropylidene diphthalimide) (6FDA‐PDA). Water‐sorption behaviors of polyimide films were gravimetrically investigated at 25°C and 22–100% relative humidity by using the modified e… Show more

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Cited by 31 publications
(42 citation statements)
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“…Coated wafers were prebaked at 80°C for 30min on a hot plate. The prebaked samples were then placed in a curing oven and cured by the following cure schedule [11][12][13][14][15][16][17][18][19] : 150°C/30 min, 230°C/30 min, 300°C/30 min, and 400°C/60 min. 8 -11 The ramping rate for each step was 2.5°C/min and the cooling rate was 2.0°C/min for the curing process.…”
Section: Materials and Film Preparationmentioning
confidence: 99%
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“…Coated wafers were prebaked at 80°C for 30min on a hot plate. The prebaked samples were then placed in a curing oven and cured by the following cure schedule [11][12][13][14][15][16][17][18][19] : 150°C/30 min, 230°C/30 min, 300°C/30 min, and 400°C/60 min. 8 -11 The ramping rate for each step was 2.5°C/min and the cooling rate was 2.0°C/min for the curing process.…”
Section: Materials and Film Preparationmentioning
confidence: 99%
“…These were described in our previous literature. [11][12][13][14][15][16][17][18][19] All the sorption isotherms were analyzed with Fick's second law given by Crank and Park 20,21 :…”
Section: Water Sorptionmentioning
confidence: 99%
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