2016
DOI: 10.1088/1742-6596/745/2/022002
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Waves, Instabilities, and Rivulets in High Quality Microgap Two-Phase Flow

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Cited by 19 publications
(7 citation statements)
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“…One of the promising ways of removing large heat fluxes from the surface of heatstressed elements of electronic devices is the use of two-phase flows in microchannels [1,2]. The most efficient flow regimes in the channel (in terms of heat removal) is annular or stratified flow [3]. Flow regimes are of interest for study [4][5][6], investigation has been carried out for various channel parameters.…”
Section: Introductionmentioning
confidence: 99%
“…One of the promising ways of removing large heat fluxes from the surface of heatstressed elements of electronic devices is the use of two-phase flows in microchannels [1,2]. The most efficient flow regimes in the channel (in terms of heat removal) is annular or stratified flow [3]. Flow regimes are of interest for study [4][5][6], investigation has been carried out for various channel parameters.…”
Section: Introductionmentioning
confidence: 99%
“…Today, in DATA centers, about 30-40% of all energy is used by cooling system. Currently, the global industry is ready to produce high-performance electronic components where the heat flux density at individual sites can reach 1000 W/cm 2 and higher [1]. However, the introduction and use of these devices faces challenges of removing such high specific heat fluxes into the ambient medium.…”
Section: Introductionmentioning
confidence: 99%
“…One of the promising ways of removing large heat fluxes from the surface of heatstressed elements of electronic devices is the use of two-phase flows in microchannels [2,3]. The most efficient flow regimes in the channel (in terms of heat removal) are annular or stratified flow [1]. Authors of [4][5][6] suggested to use artificially formed stratified flow in the channel, namely a thin liquid film, moving under the action of the gas flow in the channel.…”
Section: Introductionmentioning
confidence: 99%
“…Development of the modern microelectronic equipment requires the effective cooling solutions because it is necessary to remove high heat fluxes of up to 1 kW/cm 2 and higher from the local hot spots of the processor [1]. Thin and ultra-thin (less than 10 µm in thickness) liquid films, moving under the action of a forced gas flow in a mini-channel, are promising for the use in the temperature control systems of modern semiconductor devices [2].…”
Section: Introductionmentioning
confidence: 99%