2015
DOI: 10.1016/j.diamond.2015.06.004
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Wear process of single crystal diamond affected by sliding velocity and contact pressure in mechanical polishing

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Cited by 31 publications
(4 citation statements)
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“…MP is the most widely used diamond polishing technique due to its simple equipment and low cost [87,88]. The cost of CMP is higher than that of MP, and it is widely used for precision polishing of diamond substrates [81].…”
Section: Characteristics and Limitations Of Conventional Polishing Te...mentioning
confidence: 99%
“…MP is the most widely used diamond polishing technique due to its simple equipment and low cost [87,88]. The cost of CMP is higher than that of MP, and it is widely used for precision polishing of diamond substrates [81].…”
Section: Characteristics and Limitations Of Conventional Polishing Te...mentioning
confidence: 99%
“…On the other hand, micromasking has been exploited to produce high aspect ratio features on diamond. [74][75][76][77] The second challenge arising from the use of metal masks during diamond etching is mesa sidewall surface quality and angle control. As the etch proceeds, the mask sputters and redeposits onto the sidewall creating a protective layer.…”
Section: Patterning Of Diamond With Reactive Ion Etchingmentioning
confidence: 99%
“…The seed substrate must be smooth enough for producing defect free SCD surface [119]. However there are polishing techniques which can produce atomically flat silicon substrates but producing atomically flat diamond [120] seed substrate needs further research. Growth hillocks ( Figure 7I) are formed due to preferential spiral growth at the site of screw dislocation in seed substrate, which are invariably present (10 4 -10 5 cm −2 ).…”
Section: Growth Theory Of Scdsmentioning
confidence: 99%