Wearout Reliability and Intermetallic Compound Diffusion Kinetics of Au and PdCu Wires Used in Nanoscale Device Packaging

Gan, Chong Leong; Ng, EK; Chan, B. L.; Classe, F. C.; Kwuanjai, T.; Hashim, U.

doi:10.1155/2013/486373

Cited by 26 publications

(24 citation statements)

References 26 publications

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“…Figure 13 illustrates a Cu ball bond with lower package reliability margin and usually more susceptible to Cu moisture corrosion test under UHAST condition. This has been reported in our previous literature works [8,[25][26][27]31]. Cu ball bond has a layer of Pd coated on low-corrosive resistance Cu wire which inhibits moisture ball bond corrosion in UHAST conditions (130°C, 85 %RH).…”

Section: Cu and Au Ball Bond Corrosion (Biased Hast And Unbiased Hast)supporting

confidence: 66%

“…Au and Cu ball bond microcracking in HTSL Au ball bond is found with higher IMC growth rate at least 5× compared to Cu ball bond in HTSL aging test [1,25]. Hence, there is slightly different HTSL failure mechanism after long duration of aging stress in Au and Cu ball bonds.…”

Section: Cu and Au Ball Bond Corrosion (Biased Hast And Unbiased Hast)mentioning

confidence: 99%

“…Pd atoms in the Pd-coated Cu wire do not participate in the interfacial reaction, and have no marked effect on the growth rate of IMCs. Gan et al conducted studies on effects of bonding wires on UHAST and TC reliability and found Au with better UHAST reliability compare to Cu wire [25][26][27][28][29][30][31]. Au ball bond is well known with its Au atomic diffusion into Al metallization and caused resistive ball bonds with non-optimized bonding parameter [1,25].…”

Section: Introductionmentioning

confidence: 99%

“…Gan et al conducted studies on effects of bonding wires on UHAST and TC reliability and found Au with better UHAST reliability compare to Cu wire [25][26][27][28][29][30][31]. Au ball bond is well known with its Au atomic diffusion into Al metallization and caused resistive ball bonds with non-optimized bonding parameter [1,25]. The interdiffusion between Au and Al across a thermally exposed Au-Al ball bond causes the movement of the void line towards the Au bump and shows that Au interdiffuses faster than Al.…”

Section: Introductionmentioning

confidence: 99%

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Evolution and investigation of copper and gold ball bonds in extended reliability stressing

Gan

Francis²,

Chan³

et al. 2014

Gold Bull

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This paper discusses the microstructure evolution of copper (Cu) and gold (Au) ball bonds after various extended reliability stresses such as biased highly accelerated temperature and humidity test (HAST), unbiased highly accelerated temperature and humidity test (UHAST), temperature cycling (TC), and high temperature storage life (HTSL) in BGA package. Objective of this study is to study the microstructure evolution and changes after long hours and long cycles of component reliability stressing and its predicted failure mechanisms and to determine the long-term reliability comparison with combination of bonding wires in HAST, UHAST, and TC. Secondary electron microscopy (SEM) and energy dispersive X-ray (EDX) have been carried out to understand the respective microstructure of failed samples in HAST, UHAST, TC, and HTSL long-term reliability failures. Respective failure mechanisms of copper and gold ball bonds carrion under HAST and UHAST, ball bond lifting in TC and HTSL have been analyzed and proposed. The evolution of surface morphology, including copper and gold ball bond micro cracking, gold ball bond Kirkendall microvoiding and intermetallic compound (IMC) formation, was studied in FBGA package with copper and gold ball bonds during various reliability stresses. Biased HAST, UHAST, TC, and HTSL mechanisms were proposed to explain the observed morphological changes and the resulting ball bond wear out modes after extended reliability stresses. Weibull reliability analyses have been established to compare the performance of copper and gold ball bonds under humid and dry environmental tests.

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Section: Cu and Au Ball Bond Corrosion (Biased Hast And Unbiased Hast)supporting

confidence: 66%

Section: Cu and Au Ball Bond Corrosion (Biased Hast And Unbiased Hast)mentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Evolution and investigation of copper and gold ball bonds in extended reliability stressing

Gan

Francis²,

Chan³

et al. 2014

Gold Bull

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“…Hence, extended reliability is crucial to determine the lifetime of gold and copper ball bonds in microelectronic packaging. The Cu-Al and Au-Al IMC growth kinetics were studied, and it was found that Cu-Al growth is at least 5× slower than Au-Al IMC [16]. However, copper wire bonding still pose reliability challenges and complex failure mechanisms which could be the main barriers to entirely replace gold wire bonding [17].…”

Section: Introductionmentioning

confidence: 99%

Extended reliability of gold and copper ball bonds in microelectronic packaging

Gan

Francis²,

Chan³

et al. 2013

Gold Bull

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Wire bonding is the predominant mode of interconnection in microelectronic packaging. Gold wire bonding has been refined again and again to retain control of interconnect technology due to its ease of workability and years of reliability data. Copper (Cu) wire bonding is well known for its advantages such as cost-effectiveness and better electrical conductivity in microelectronic packaging. However, extended reliabilities of Cu wire bonding are still unknown as of now. Extended reliabilities of Au and Pd-coated Cu (Cu) ball bonds are useful technical information for Au and Cu wire deployment in microelectronic packaging. This paper discusses the influence of wire type and mold compound effect on the package reliability and after several component reliability stress tests. Failure analysis has been conducted to identify its associated failure mechanisms after the package conditions for Au and Cu ball bonds. Extended reliabilities of both wire types are investigated after unbiased HAST (UHAST), temperature cycling (TC), and high-temperature storage life test (HTSL) at 150, 175, and 200°C aging temperatures. Weibull plots have been plotted for each reliability stress. Obviously, Au ball bond is found with longer time to failure in unbiased HAST stress compared to Cu ball bonds for both mold compounds. Cu wire exhibits equivalent package and or better reliability margin compared to Au ball bonds in TC and HTSL tests. Failure mechanisms of UHAST and TC have been proposed, and its mean time to failure (t 50 ), characteristic life (t 63.2 , η), and shape parameter (ß) have been discussed in this paper. Feasibility of silver (Ag) wire bonding deployment in microelectronic packaging is discussed at the last section in this paper.

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