2020
DOI: 10.1016/j.apsusc.2019.144452
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Wet etching mechanism of Er2O3 grown on Si by molecular beam epitaxy

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Cited by 4 publications
(2 citation statements)
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“…167,168 Wet etching removes materials using a solution's chemical reaction, resulting in isotropic characteristics. 169 Dry etching involves using plasma to react with a surface and form volatile substances that can etch materials. This process can be classified into reactive ion etching, reactive gas etching, and laser processing.…”
Section: Construction Strategiesmentioning
confidence: 99%
“…167,168 Wet etching removes materials using a solution's chemical reaction, resulting in isotropic characteristics. 169 Dry etching involves using plasma to react with a surface and form volatile substances that can etch materials. This process can be classified into reactive ion etching, reactive gas etching, and laser processing.…”
Section: Construction Strategiesmentioning
confidence: 99%
“…Moreover, it isn't easy to implement assorted BBPDs within standard Si-based complementary metal-oxide-semiconductor (CMOS) facilities because it requires simultaneous photodetection and corresponding electronic processing [8,9,12]. Wide bandgap (>5 eV) semiconductor Er 2 O 3 , in this context, shows broadband absorption properties, is mostly chemically inert with Si, and heterostructures on Si essentially exhibit high conduction-band-offsets (CBOs) [13][14][15]. Thus, proper material and surface engineering of Er 2 O 3 can potentially tune the band alignment of heterostructures, leading to improved broad-spectrum response.…”
Section: Introductionmentioning
confidence: 99%