Wettability and interfacial reactions between the molten Sn–3.0 wt%Ag–0.5 wt%Cu solder (SAC305) and Ni–Co alloys

Chen, Yueting; Chan, Yin-Ching; Chen, Chih-Chi

doi:10.1016/j.jallcom.2010.08.006

Cited by 17 publications

(6 citation statements)

References 41 publications

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“…SAC305 is the most widely used solder for electrical interconnections for various electronic applications. , This eutectic solder shows a relatively high melting point of 219 °C. Thus, it requires a latent cure mechanism to prevent the film gelation.…”

Section: Results and Discussionmentioning

confidence: 99%

“…This strategic reconfiguration has further been sophisticatedly adapted as adhesives and sealants for high-performance electronics applications, such as highly bendable transparent thin-film transistors, foldable printed circuit boards, and flexible microfluidic devices . In particular, epoxy adhesives have attracted considerable attention for electrical interconnections between semiconductor chips and substrates such as flip chip bonding due to their superior adhesion to various substrates, caused by the generated hydroxyls. − Sn-based fusible solders, such as Sn/Ag caps on Cu pillars, have been employed for electrical interconnections via melting and wetting of the solders. − However, these Sn-based solders are susceptible to oxidation on the surface, thus requiring a reductant for wettability of the solder, thereby making an electrical path. Without oxidizing capability, the solder balls are surrounded and stuck by the solder oxide layers even above its melting point, causing wetting failure. , However, residual reductants cause corrosion, and the hollow structure without packing materials between electrical paths results in reduced mechanical robustness. ,, These drawbacks can be minimized by cleaning and filling vacancies between electrical paths with epoxy resins, which are tedious procedures .…”

Section: Introductionmentioning

confidence: 99%

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Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection

Jang

Eom

Choi

et al. 2018

Ind. Eng. Chem. Res.

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We manufactured a hybrid adhesive film capable of curable deoxidization by combining thermoplastics and thermosets. The generated acidic moieties on this hybrid adhesive film completely removed the oxide layer of various Sn-based metal solders and Cu, leading to electrical interconnection. The chemical structure, reaction rate, and glass transition temperature (T g) of the films were examined via Fourier transform infrared spectroscopy and differential scanning calorimetry. The initial reaction rate of the hybrid deoxidizing adhesive films increased with increasing concentration of anhydride and phenoxy resin. Meanwhile, the reaction rate at the end for curing completion decreased as a function of anhydride and phenoxy resin. T g of the films decreased with the increase in anhydride and phenoxy resin concentrations. The fabricated film resulted in complete wetting of the solder/Cu for electrical interconnection between semiconductor chips as a promising electronic application. This hybrid film can be useful for various applications requiring deoxidization and adhesion.

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Section: Results and Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection

Jang

Eom

Choi

et al. 2018

Ind. Eng. Chem. Res.

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“…Wettability is related to the bonding quality of solders. Excellent wettability is a prerequisite for forming a reliable joint for industrial applications [54]. Wettability is determined by measuring the contact angle, θ, at the interface between the solder alloy and Cu substrate.…”

Section: Wettabilitymentioning

confidence: 99%

Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions

et al. 2023

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Low Ag lead-free Sn-Ag-Cu (SAC) solders have attracted great interest due to their good drop resistance, high welding reliability, and low melting point. However, low Ag may lead to the degradation of the mechanical properties. Micro-alloying is an effective approach to improving the properties of SAC alloys. In this paper, the effects of minor additions of Sb, In, Ni, and Bi on microstructure, thermal and mechanical properties of Sn-1 wt.%Ag-0.5 wt.%Cu (SAC105) were systematically investigated. It is found that the microstructure can be refined with intermetallic compounds (IMCs) distributed more evenly in the Sn matrix with additions of Sb, In, and Ni, which brings a combined strengthening mechanism, i.e., solid solution strengthening and precipitation strengthening, leading to the tensile strength improved of SAC105. When Ni is substituted by Bi, the tensile strength is further enhanced with a considerable tensile ductility higher than 25%, which still meets the practical demands. At the same time, the melting point is reduced, the wettability is improved, and the creep resistance is enhanced. Among all the investigated solders, SAC105-2Sb-4.4In-0.3Bi alloy possesses the optimized properties, i.e., the lowest melting point, the best wettability, and the highest creep resistance at room temperature, implying that element alloying plays a vital role in improving the performance of SAC105 solders.

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“…Epoxy resins have also been used as underfill substances that are filled between the chips and substrates and thus act as an underfill encapsulant as well as an adhesive [ 2 , 6 , 7 ]. For electrical interconnections between chips and substrates, Sn-based fusible metal solders, such as Sn/Ag and Sn/Ag/Cu caps on Cu pillars, have been utilized [ 8 , 9 , 10 ]. At elevated temperatures, the metal solders are melted and wetted, thereby creating an electrical path between the chips and substrates [ 11 ].…”

Section: Introductionmentioning

confidence: 99%

Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities

Lee

Jang

2021

Polymers

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Epoxy resins with acidic compounds feature adhesion, robustness, and deoxidizing ability. In this study, hybrid adhesive films with deoxidizing and curing capabilities for semiconductor packaging were fabricated. The compatibilizing effects and mechanical properties were chiefly investigated by using various additive binders (thermoplastic amorphous polymers) and compatibilizing agents. The curing, deoxidizing, thermal, and rheological properties were systematically investigated. For uniform film formation and maximizing deoxidizing curable abilities, a thermoplastic--thermoset mixture containing a phenyl and carboxylic acid-based additive (benzoic acid), and a polycarbonate was chosen as the model adhesive film. Without either a phenyl or an acidic group in the compatibilizing agent, deoxidizing and compatibilizing effects were not achieved. The manufactured hybrid adhesive film can be effectively used, especially for electronic devices that require deoxidization and adhesion.

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Wettability and interfacial reactions between the molten Sn–3.0 wt%Ag–0.5 wt%Cu solder (SAC305) and Ni–Co alloys

Cited by 17 publications

References 41 publications

Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection

Versatile Epoxy/Phenoxy/Anhydride-Based Hybrid Adhesive Films for Deoxidization and Electrical Interconnection

Investigation of Microstructure and Mechanical Properties of SAC105 Solders with Sb, In, Ni, and Bi Additions

Impact Modifiers and Compatibilizers for Versatile Epoxy-Based Adhesive Films with Curing and Deoxidizing Capabilities

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