Wettability of silicon nitride by aluminium, copper and silver

Naka, Masaaki; Kubo, Masao; Okamoto, Ikuo

doi:10.1007/bf01729884

Cited by 30 publications

(9 citation statements)

References 2 publications

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“…Figure 2(a) shows an external view of the Si 3 N 4 /Si 3 N 4 joint brazed at 1173 K for 3.6 ks using only AgCu filler metal. Since the wetting of molten Ag and Cu on the ceramics is known to be poor, 11) the filler metal does not contribute to the bonding and becomes spherical shape. The external views of the AlN/AlN joints prepared at 1173 K for 3.6 ks using the AgCu filler metals containing Ti, Zr, V and Nb are shown in Figs.…”

Section: Results and Discussion 31 External Views Of The Brazed Jointsmentioning

confidence: 99%

Interfacial Microstructures and Bonding Strength between Aluminum Nitride and Silver Brazing Filler Metals Containing Various Active Elements

Morizono

Nishida²,

Chiba³

et al. 2004

J. Ceram. Soc. Japan

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Effect of active element on interfacial microstructures and bonding strength of brazed AlN/AlN joints has been investigated and compared with the case of brazed Si 3 N 4 /Si 3 N 4 joints. Brazing was carried out at 1173 to 1473 K for 3.6 ks in a vacuum using AgCu filler metals containing Ti, Zr, V and Nb as an active element. The obtained joint had no defects such as unbonded areas, regardless of active element and bonding temperature. Four kinds of active elements were divided into two groups by shear tests and microstructural observations. One was Ti and Zr, and the other was V and Nb. The bonding strength of the former was higher than that of the latter. In par ticular, the joint with Ti addition showed an excellent strength of about 200 MPa. Main fracture position in the joints with Ti and Zr additions was within the AlN, while most joints with V and Nb additions broke at the inter face between the active filler metal and the AlN. In the former, TiN and ZrN layers consisting of fine grains were observed adjacent to the AlN. On the other hand, the joint with Nb addition had roundish grains of Nb 2 N in similar locations. It was considered that the existence of fine grains contributed to the enhancement of bonding strength due to the increase of contact area and to the formation of complicated interface. These tendencies were essentially consistent with those of the

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Section: Results and Discussion 31 External Views Of The Brazed Jointsmentioning

confidence: 99%

Interfacial Microstructures and Bonding Strength between Aluminum Nitride and Silver Brazing Filler Metals Containing Various Active Elements

Morizono

Nishida²,

Chiba³

et al. 2004

J. Ceram. Soc. Japan

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“…A number of studies have evaluated the wettability of oxide ceramics by glasses and metals [52][53][54][55] and the wettability of nitride ceramics by molten metals [56][57][58][59]. Far fewer studies have examined the wettability of nitride ceramics by glasses [30,31,60].…”

Section: Contact Angle and Wettabilitymentioning

confidence: 99%

“…2. Time-dependent contact angles have been observed in the following metal/ceramic couples: Al/Si3N4, Al/AIN, and Al-In/ AIN [56,58]. Time-dependent contact angles have also been observed and studied in other systems; for example, lead borosilicate glasses on ruthenium dioxide [64]; polymer melts on aluminum, mica, and Teflon [65]; and water on glass and molten copper on iron [66].…”

Section: Contact Angle and Wettabilitymentioning

confidence: 99%

The influence of contact angle, wettability, and reactivity on the development of indirect-bonded metallizations for aluminum nitride

Norton

1992

Journal of Adhesion Science and Technology

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The use of aluminum nitride (AIN) as a substrate and packaging material for microcircuit applications is of present interest due to its many advantageous physical properties. A limitation to the widespread use of AIN is the lack of an adequate metallization system. In this paper, the indirectbonded metallization of AIN will be reviewed-in particular, thick-film metallization, where the intermediate material is often a glass, and brazing, where the intermediate material is an active metal. Requirements which must be considered in producing successful metallizations include wetting of the substrate and the metal by the intermediate phase, and the reactivity between the intermediate phase and the substrate. In the case of thick-film metallization, these reactions can often be deleterious to the properties of the metal layer. In brazing, reaction between the active metal and the substrate is essential for achieving wetting of the ceramic surface by the molten braze and, thus, for producing high-strength joints. The reactions which occur in many of the systems considered can be predicted by examination of thermodynamic data.

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“…However, due to the poor wetting between the reinforcements and the Cu matrix [4][5][6], the ceramic reinforcements can result in a decreased densification of CMMCs. As a result, the mechanical properties, thermal conductivity, and wear resistance all can be weakened by the poor densification.…”

Section: Introductionmentioning

confidence: 98%

The effect of modified interfaces on the mechanical property of β-silicon nitride whiskers reinforced Cu matrix composites

Yin

Yao

Xia

et al. 2014

Journal of Alloys and Compounds

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Wettability of silicon nitride by aluminium, copper and silver

Cited by 30 publications

References 2 publications

Interfacial Microstructures and Bonding Strength between Aluminum Nitride and Silver Brazing Filler Metals Containing Various Active Elements

Interfacial Microstructures and Bonding Strength between Aluminum Nitride and Silver Brazing Filler Metals Containing Various Active Elements

The influence of contact angle, wettability, and reactivity on the development of indirect-bonded metallizations for aluminum nitride

The effect of modified interfaces on the mechanical property of β-silicon nitride whiskers reinforced Cu matrix composites

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