Wetting behavior of electrolyte in fine pitch Cu/Sn bumping process by electroplating

Jiang, Jin; Bi, Jinglin; Chen, Zhuo; Li, Ming; Mao, Dali; Suga, Tadatomo

doi:10.1109/icept.2009.5270628

Cited by 3 publications

(2 citation statements)

References 6 publications

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“…The polymer liquid was firstly dispensed to wet the photo-resist, and then, the liquid flowed into the vias; the low spinning speed made liquid wet the whole wafer (photo-resist and vias); lastly, the layer thickness was set at a higher spinning speed. During these processes, the 1 (CA between photo-resist and liquid) and 2 (CA between silicon substrate and liquid) were important parameters for wetting behavior [7]. Fig.3 showed the time-dependent viscosity variation of polymer liquids at 25 o C with a shear rate of 1 s -1 .…”

Section: Methodsmentioning

confidence: 99%

Wetting behavior of polymer liquid in insulation process for through silicon via

Zhao

Zhang

Sun

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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3D packaging using through silicon via (TSV) technology is becoming important in the integrated circuit (IC) packaging industry. This paper reports the wetting behavior of polymer liquids in the insulation deposition process by spin coating. Two methods containing adding wetting agent into polymer liquid and coupling agent treatments to wafer surface were implemented to improve the wettability between the liquid and the wafer. From the viscosity tests, it was found that the wetting agent could improve the flowability and have little effect on the thixotropy of liquid. Besides, the surface tension of liquid was shifted to 31.14 mN/m from 32.16 mN/m with the addition of wetting agent. The coupling agent treatment to sidewall of vias (silicon) could increase the adhesion work value by at least 8 mN/m and avoid the sagging. Moreover, the wetting dynamics revealed that adding wetting agent to polymer liquid and coupling agent treatments to wafer could improve the wetting rate and decrease the balanced contact angle.

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Section: Methodsmentioning

confidence: 99%

Wetting behavior of polymer liquid in insulation process for through silicon via

Zhao

Zhang

Sun

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

View full text Add to dashboard Cite

show abstract

“…Furthermore, the galvanic bath did not properly wet the photoresist, resulting in defects in the corners of the patterns due to trapped air bubbles, which masked the surface during galvanization. To solve this, 50 ppm Sodium Chloride was added to the solution as chloride ions behave as a surfactant in the solution [49]. The resulting copper layer is much more uniform and consists of 3-4 mm small crystals and growths with a rate of 32 mm/h.…”

Section: Electroplating and Technology Optimizationmentioning

confidence: 99%

Integrated cooling solution for concentrator photovoltaic cells

Rózsás

Bognár

Takács

et al. 2021

Pollack

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The efficiency of the most modern photovoltaic cells currently reaches 40–45%, which is achieved by concentrator systems. However, despite better device efficiencies concentrator photovoltaic cells have major drawback, namely the high amount of waste heat, which requires new cooling solutions.This paper gives a short overview of the current cooling techniques and proposes a novel microchannel cooling solution for concentrator photovoltaic cells. In the concept, the microscale channels are integrated into the backside metallization of the PV device. The paper gives a description of the technological process that can be used to produce microchannels on the back of solar cells and shows the optimization of the channels to achieve optimal cooling performance.

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Review on the electrodeposition and properties of high-density chip interconnection

Wu,

Hang,

Ling

et al. 2023

Sci. Sin.-Chim

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Wetting behavior of electrolyte in fine pitch Cu/Sn bumping process by electroplating

Cited by 3 publications

References 6 publications

Wetting behavior of polymer liquid in insulation process for through silicon via

Wetting behavior of polymer liquid in insulation process for through silicon via

Integrated cooling solution for concentrator photovoltaic cells

Review on the electrodeposition and properties of high-density chip interconnection

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