When enough is enough

Hansen, Steffen Foss; Baun, Anders

doi:10.1038/nnano.2012.115

Cited by 79 publications

(60 citation statements)

References 24 publications

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“…[67][68][69][70][71][72] Sivolella et al reviewed potential clinical applications in alveolar bone and dental implant surgery of AgNP-based devices. 73 The authors suggested that AgNPs may be an alternative strategy for reducing bacterial adhesion and preventing biofilm formation, despite AgNPs having exhibited some toxic effects in in vitro and in vivo studies.…”

Section: Nanoparticles In Dental Applicationsmentioning

confidence: 99%

Toxicology of antimicrobial nanoparticlesfor prosthetic devices

Núñez-Anita¹,

Acosta-Torres²,

Vilar-Pineda³

et al. 2014

IJN

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Advances in nanotechnology are producing an accelerated proliferation of new nanomaterial composites that are likely to become an important source of engineered health-related products. Nanoparticles with antifungal effects are of great interest in the formulation of microbicidal materials. Fungi are found as innocuous commensals and colonize various habitats in and on humans, especially the skin and mucosa. As growth on surfaces is a natural part of the Candida spp. lifestyle, one can expect that Candida organisms colonize prosthetic devices, such as dentures. Macromolecular systems, due to their properties, allow efficient use of these materials in various fields, including the creation of reinforced nanoparticle polymers with antimicrobial activity. This review briefly summarizes the results of studies conducted during the past decade and especially in the last few years focused on the toxicity of different antimicrobial polymers and factors influencing their activities, as well as the main applications of antimicrobial polymers in dentistry. The present study addresses aspects that are often overlooked in nanotoxicology studies, such as careful time-dependent characterization of agglomeration and ion release.

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Section: Nanoparticles In Dental Applicationsmentioning

confidence: 99%

Toxicology of antimicrobial nanoparticlesfor prosthetic devices

Núñez-Anita¹,

Acosta-Torres²,

Vilar-Pineda³

et al. 2014

IJN

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show abstract

“…This widespread use in combination with the inherent toxic potential has raised concern about their human health and environmental effects (Hartemann et al, 2015), which has in turn resulted in a large number of experimental studies and reviews on the toxicity of AgNP (Fabrega et al, 2011;Hansen and Baun, 2012;Kim et al, 2013;Lapresta-Fernández et al, 2012;Levard et al, 2012;Sharma et al, 2014).…”

Section: Introductionmentioning

confidence: 99%

Behavior and chronic toxicity of two differently stabilized silver nanoparticles to Daphnia magna

et al. 2016

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“…103,104 The consensus is that metallic Ag is of relatively low toxicity; a non-lifethreatening bluish-grey discoloration of the skin, also known as argyria, is the only side effect when it is ingested or inhaled in high dosages. 105 The antimicrobial properties of Ag nanoparticles have also been reported in the literature, 104,106 although these results are often challenged because there are no standardized methods of testing these properties in vivo. 105 In the case of microelectronics-grade nano-Ag paste, the synthesis and production of Ag nanoparticles is performed in solvent environments before they are formulated into a paste form.…”

Section: Health Concerns Of Ag Nanoparticlesmentioning

confidence: 99%

“…105 The antimicrobial properties of Ag nanoparticles have also been reported in the literature, 104,106 although these results are often challenged because there are no standardized methods of testing these properties in vivo. 105 In the case of microelectronics-grade nano-Ag paste, the synthesis and production of Ag nanoparticles is performed in solvent environments before they are formulated into a paste form. Hence, the risk of Ag nanoparticles being inhaled or ingested by humans is minimal.…”

Section: Health Concerns Of Ag Nanoparticlesmentioning

confidence: 99%

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

Siow

2014

Journal of Elec Materi

278

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Silver (Ag) has been under development for use as interconnect material for power electronics packaging since the late 1980s. Despite its long development history, high thermal and electrical conductivities, and lead-free composition, sintered Ag technology has limited market penetration. This review sets out to explore what is required to make this technology more viable. This review also covers the origin of sintered Ag, the different types and application methods of sintered Ag pastes and laminates, and the long-term reliability of sintered Ag joints. Sintered Ag pastes are classified according to whether pressure is required for sintering and further classified according to their filler sizes. This review discusses the main methods of applying Ag pastes/laminates as dieattach materials and the related processing conditions. The long-term reliability of sintered Ag joints depends on the density of the sintered joint, selection of metallization or plating schemes, types of substrates, substrate roughness, formulation of Ag pastes/laminates, joint configurations (i.e., joint thicknesses and die sizes), and testing conditions. This paper identifies four challenges that must be overcome for the proliferation of sintered Ag technology: changes in materials formulation, the successful navigation of the complex patent landscape, the availability of production and inspection equipment, and the health concerns of Ag nanoparticles. This paper is expected to be useful to materials suppliers and semiconductor companies that are considering this technology for their future packages.

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When enough is enough

Cited by 79 publications

References 24 publications

Toxicology of antimicrobial nanoparticlesfor prosthetic devices

Toxicology of antimicrobial nanoparticlesfor prosthetic devices

Behavior and chronic toxicity of two differently stabilized silver nanoparticles to Daphnia magna

Are Sintered Silver Joints Ready for Use as Interconnect Material in Microelectronic Packaging?

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