Why you will use the deep X-ray LIG(A) technology to produce MEMS?

Meyer, Pascal; Schulz, Joachim; Hahn, L.; Saile, V.

doi:10.1007/s00542-007-0503-1

Cited by 26 publications

(20 citation statements)

References 8 publications

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“…[13] Deep X-Ray Lithography (DXRL) offers a method to reliably manufacture microstructures with a number of features. [14] Three-dimensional structures have been generated in a thick layer (up to 600 mm) using DXRL, and the process allows fast production of ultra-precise microstructures with extreme aspect ratio. [15] Moreover, polymeric three-dimensional structures with sub-micrometer resolution have been patterned showing rods with a radius of 200 nm but an even better lateral resolution is possible.…”

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confidence: 99%

Fabrication of Advanced Functional Devices Combining Soft Chemistry with X‐ray Lithography in One Step

et al. 2009

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Deep X-ray lithography combined with sol-gel techniques offers facile fabrication of controlled patterned films. Using sol-gel, different functional properties can be induced; deep X-ray lithography alters the functionality in the exposed regions. Miniaturized devices based on local property changes are easily fabricated: this technique requires no resist, enabling direct patterning of films in a one-step lithographic process.

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confidence: 99%

Fabrication of Advanced Functional Devices Combining Soft Chemistry with X‐ray Lithography in One Step

et al. 2009

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“…, that is, structures with a large height/width ratio, have found many applications 1,2 such as X-ray gratings 3 , gas chromatography columns 4 , magnetic coils 5 , X-ray telescopes 6 , micro-gears 7 , micro-capacitors with highaspect-ratio (HAR) cantilevers 8 , and micromechanical and microoptical elements 9,10 . These structures exhibit aspect ratios (ARs) of over 10 and almost vertical sidewalls, making them much more challenging to develop than the structures typically used in planar technology with moderate ARs of 1 to 2.…”

Section: High-aspect-ratio Microstructures (Harms)mentioning

confidence: 99%

High-aspect-ratio nanoimprint process chains

et al. 2017

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Different methods capable of developing complex structures and building elements with high-aspect-ratio nanostructures combined with microstructures, which are of interest in nanophotonics, are presented. As originals for subsequent replication steps, two families of masters were developed: (i) 3.2 μm deep, 180 nm wide trenches were fabricated by silicon cryo-etching and (ii) 9.8 μm high, 350 nm wide ridges were fabricated using 2-photon polymerization direct laser writing. Both emerging technologies enable the vertical smooth sidewalls needed for a successful imprint into thin layers of polymers with aspect ratios exceeding 15. Nanoridges with high aspect ratios of up to 28 and no residual layer were produced in Ormocers using the micromoulding into capillaries (MIMIC) process with subsequent ultraviolet-curing. This work presents and balances the different fabrication routes and the subsequent generation of working tools from masters with inverted tones and the combination of hard and soft materials. This provides these techniques with a proof of concept for their compatibility with high volume manufacturing of complex micro-and nanostructures.Keywords: cryo-etching; direct 6 write laser lithography; high aspect ratio; moulding; nanoimprint lithography; Ormocer; photonic nanofences; 2-photon polymerization INTRODUCTION High-aspect-ratio microstructures (HARMS), that is, structures with a large height/width ratio, have found many applications 1,2 such as X-ray gratings 3 , gas chromatography columns 4 , magnetic coils 5 , X-ray telescopes 6 , micro-gears 7 , micro-capacitors with highaspect-ratio (HAR) cantilevers 8 , and micromechanical and microoptical elements 9,10 . These structures exhibit aspect ratios (ARs) of over 10 and almost vertical sidewalls, making them much more challenging to develop than the structures typically used in planar technology with moderate ARs of 1 to 2. They are therefore characterized by an intermediate state between two-and threedimensional (2D and 3D), that is, a 2D planar design that is extended into the vertical dimension and often called . There are several methods to produce HAR structures on typical planar substrates, most of them relying on the anisotropy of subtractive pattern transfer of a low AR masking layer into an underlying resist or substrate, that is, by using mask based ultraviolet (UV)-photolithography (PL) with an AR up to 5, silicon etching (for example, dry etching) with an AR up to 20, and direct write laser lithography (DWL) and X-ray lithography with ARs 420 (Refs. 12-15). These methods are continually being improved to produce a higher AR and smaller lateral dimensions. Furthermore, they are enlarged by new techniques that are often subsets of etching processes with different advantages and disadvantages. One of those challenges is the suitability for submicron and nanopatterning, that is, structures with lateral sizes much smaller than 1 μm and the possibility to combine micro-with nanostructures in the same material.There are three main approaches: (1)...

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“…Novel approaches for improvement of X-ray LIGA process for micro insert fabrication are in permanent research in academy Meyer et al, 2008). Although with deep ray X LIGA it is possible to obtain very accurate patterns of micro features with high aspect ratios up to 100 and micro structures with size less than 250 nm, it is still not a widespread commercial technique for micro replication, being time consuming and costly (Despa et al, 1999;Meyer et al, 2008).…”

Section: Mould Insert Fabricationmentioning

confidence: 99%

“…Although with deep ray X LIGA it is possible to obtain very accurate patterns of micro features with high aspect ratios up to 100 and micro structures with size less than 250 nm, it is still not a widespread commercial technique for micro replication, being time consuming and costly (Despa et al, 1999;Meyer et al, 2008). UV-LIGA and IB (Ion Beam) LIGA technologies are less complex and costly comparing to the X-ray LIGA process.…”

Section: Mould Insert Fabricationmentioning

confidence: 99%