“…For a wafer thickness of 165 μm, the estimated practical limit for iV oc is 748 mV according to Yoshikawa et al 23 To achieve such values close to the practical limit, Taguchi et al 22 claim that an ultraclean surface is needed, which was not assured for the sample preparation of this work as the HWCVD growth of μc-SiC: the great potential of this layer. To further increase the transparency of the μc-SiC:H(n), a possible way is to increase the filament temperature during the HWCVD growth of μc-SiC:H(n) as it was reported before in previous studies., 6,7 However, we also reported in Köhler et al 7 26,28 and which also follow the idea of simple fabrication process. On high-quality c-Si wafer, with τ bulk = 12 ms, we calculated 26.6% for η, 42.24 mA/cm 2 for J sc , 738 mV for V oc , and 85.2% for FF.…”