Abstract:This paper presents a novel antenna in package solution with superstrate structure at 77 GHz for automotive radar applications. Two edge-coupled patches are driven by a differential signal which supports seamless integration with differential output MMICs in a single package. The antenna has a wide bandwidth (17 GHz) and stable gain. The antenna prototypes are fabricated using Embedded Wafer Level Ball Grid Array (eWLB) packaging technology. The measurement results show that the EIRP of the package (chip + ant… Show more
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