2016
DOI: 10.31399/asm.edfa.2016-1.p022
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Wire Bonding

Abstract: This article discusses the latest trends in wire bonding and examines common failure mechanisms.

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Cited by 3 publications
(4 citation statements)
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“…For comparing the developed model with the experimental results, the relative deviations of the logarithm of the cycles to failure between all experimental data points and the corresponding model data are calculated; see Equation (3).…”
Section: Quantitative Comparison Of Experimental Data With Model Datamentioning
confidence: 99%
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“…For comparing the developed model with the experimental results, the relative deviations of the logarithm of the cycles to failure between all experimental data points and the corresponding model data are calculated; see Equation (3).…”
Section: Quantitative Comparison Of Experimental Data With Model Datamentioning
confidence: 99%
“…For the transmission of electrical signals and for the electrical connection in power electronic devices, high-purity aluminum bonding wires with diameters between 125 µm and 500 µm are often used [1]. The wires are processed into bridges by ultrasonic wedge-wedge wire bonding [2][3][4]. The combination of corrosive media and different cyclic mechanical and thermal stresses during operation can lead to fatigue loads on the wire bridges because of the different thermal expansion coefficients of different substrate materials [5][6][7][8].…”
Section: Introductionmentioning
confidence: 99%
“…Al-Prime is tested with R-ratios of 0.1, 0.4 and 0.7. The R-ratio is defined by the quotient of minimum stress σmin and maximum stress σmax, see Equation 1: R = σ min σ max (1) The wires were tested up to a maximum number of cycles between 1,000,000 and 10,000,000 cycles. Each fatigue experiment was evaluated by a Python TM routine according to DIN 50100:2016-12 [14].…”
Section: Fatigue Testingmentioning
confidence: 99%
“…Heavy bonding wires made of high-purity aluminum with diameters between 125 µm and 500 µm are the most used materials for the transmission of electrical signals and for the electrical connection in power electronic devices. More than 90% of the bonding wires are processed into bridges by wedge-wedge wire bonding [1].…”
Section: Introductionmentioning
confidence: 99%