30th International Reliability Physics Symposium 1992 Help me understand this report
Wire Bonding of Aluminum/Polyimide Multi-Layer Structures
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“…Peeling of Bond Pads Similar result on aluminum bond pads on polyimide has been reported by Murali & others [16]. It was seen that the bond parameters, bond force and power has to be further optimized to have good bonding.…”
Section: Gsupporting
confidence: 78%
“…Peeling of Bond Pads Similar result on aluminum bond pads on polyimide has been reported by Murali & others [16]. It was seen that the bond parameters, bond force and power has to be further optimized to have good bonding.…”
Section: Gsupporting
confidence: 78%
“…The low modulus of the low-k dielectric material below the bond pad structure doesn't provide a rigid platform for wire bonding. So cupping of the low-k dielectric material is inevitable [16]. Once again bond power, force , temperature and time were optimized as shown in Table. 6.…”
Section: Gmentioning
confidence: 99%
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