2015 IEEE International Conference on Communication Problem-Solving (ICCP) 2015
DOI: 10.1109/iccps.2015.7454103
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WR-1.5 band waveguide bandpass dual-mode filter on silicon micromachining technique

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Cited by 3 publications
(1 citation statement)
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“…On the other hand, there is also much literature based on advanced high-precision semiconductor technologies, such as deep reactive ion etching (DRIE) [9,10], silicon via (TSV) [11,12], and microelectromechanical systems (MEMS) [13][14][15][16][17], to achieve the manufacturing of terahertz filters. Ideally, with the improvement of fabrication accuracy, performance errors can be reduced to a lower level, but due to the maturity of advanced semiconductor technology and material limitations, the current performance of terahertz devices is not excellent.…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, there is also much literature based on advanced high-precision semiconductor technologies, such as deep reactive ion etching (DRIE) [9,10], silicon via (TSV) [11,12], and microelectromechanical systems (MEMS) [13][14][15][16][17], to achieve the manufacturing of terahertz filters. Ideally, with the improvement of fabrication accuracy, performance errors can be reduced to a lower level, but due to the maturity of advanced semiconductor technology and material limitations, the current performance of terahertz devices is not excellent.…”
Section: Introductionmentioning
confidence: 99%