2013
DOI: 10.1088/1748-0221/8/08/c08003
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X-ray biomedical imaging beamline at SSRF

Abstract: Since May 6, 2009, the X-ray biomedical imaging beamline at Shanghai Synchrotron Radiation Facility (SSRF) has been formally opened to users. The beamline is composed of a wiggler source with the intensity of magnetic field of 2.0 Tesla, a double crystal monochromator (DCM) cooled with liquid nitrogen, a 6-axis filter for high heat load reducing on the downstream optics such as Be window and DCM. The photon energy range for the monochromatic beam is 8–72.5keV. Three sets of digital X-ray detectors are p… Show more

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Cited by 26 publications
(10 citation statements)
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“…The PCCT scans were performed at BL13W1 beamline of the Shanghai Synchrotron Radiation Facility (SSRF), Shanghai, China. A schematic of the experimental setup is shown in Figure .…”
Section: Methodsmentioning
confidence: 99%
“…The PCCT scans were performed at BL13W1 beamline of the Shanghai Synchrotron Radiation Facility (SSRF), Shanghai, China. A schematic of the experimental setup is shown in Figure .…”
Section: Methodsmentioning
confidence: 99%
“…The experiment was performed on X-ray imaging and biomedical application beamline (BL13W1) at Shanghai Synchrotron Radiation Facility (SSRF) [19,20]. The schematic diagram of the in-line phase contrast microscopy system is shown in Figure 1.…”
Section: Methodsmentioning
confidence: 99%
“…where dC dh represents the Cu concentration gradient at the solder/Cu 6 Sn 5 interface in the direction vertically from Cu substrate to the solder surface, as shown in Fig. 21 Therefore, the net Cu flux from Cu substrate to the liquid solder bulk can be expressed as:…”
Section: Imc Grain Size Size and Thicknessmentioning
confidence: 99%
“…A very slow cooling rate is applied by conducting furnace cooling after reflow experiment. Considering the utmost significance of non-destructive experiments [21], especially for cooling experiment, in-situ visualizations results are provided by performing synchrotron radiation imaging experiments on air cooling and furnace cooling procedures, for a Sn/Cu interface, with solder height around or less than 100 µm.…”
Section: Introductionmentioning
confidence: 99%