X-ray lenses fabricated by deep x-ray lithography

Mancini, Derrick C.; Moldovan, N.; Divan, Ralu; DeCarlo, Francesco; Yaeger, J.S.

doi:10.1117/12.451021

Cited by 9 publications

(7 citation statements)

References 7 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…There are several ways to prepare the working mask. A soft x-ray lithography and electroforming process can be used to achieve the best absorber thickness and edge acuity using an intermediate mask [5]. The use of an intermediate membrane mask for soft x-ray lithography often limits the mask to modest dimensions ($1 in · 1 in).…”

Section: Introductionmentioning

confidence: 99%

Improvements in graphite-based X-ray mask fabrication for ultradeep X-ray lithography

Divan

Mancini

Gallagher

et al. 2004

Microsystem Technologies

View full text Add to dashboard Cite

Hard x-ray masks for ultradeep x-ray lithography (UDXRL) at synchrotron radiation sources, such as the Advanced Photon Source, require a gold absorber thickness of 20-100 lm on a low-Z substrate, such as silicon, graphite, or beryllium. Graphite sheets of 0.5 mm were used for the fabrication of x-ray masks by standard optical lithography using a SU-8 photoresist. The conductivity of graphite is sufficient to perform electroplating directly without the need for a metal-plating base layer. Gold electroforming was used to deposit a 85-lm-thick patterned absorber layer. The masks were used for UDXRL using hard x-rays at the Advanced Photon Source.

show abstract

Section: Introductionmentioning

confidence: 99%

Improvements in graphite-based X-ray mask fabrication for ultradeep X-ray lithography

Divan

Mancini

Gallagher

et al. 2004

Microsystem Technologies

View full text Add to dashboard Cite

show abstract

Section: Introductionmentioning

confidence: 99%

“…The lens material is absorbing. Since the first publication search and development of suitable materials and technologies for the formation of this simplest and cheapest type of X-ray optics is going on [3][4][5][6][7][8][9].Materials consisting of light atoms allow to reduce X-ray absorption and to increase the gain in the focal spot of an X-ray lens compared to heavier materials. Minimizing the bridge distance between adjacent concave shapes of an element of an X-ray lens leads to the same result.…”

mentioning

confidence: 99%

Fabrication and preliminary testing of X-ray lenses in thick SU-8 resist layers

Nazmov

Reznikova

Mohr

et al. 2004

Microsystem Technologies

View full text Add to dashboard Cite

Deep X-ray lithography processing of SU-8 negative resist layers with thicknesses of up to 1 mm and physical-chemical properties of SU-8 polymer structures were investigated to find the optimum conditions for the fabrication of X-ray refractive lenses. The exposure was carried out at the ANKA storage ring in Karlsuhe, Germany. Experimental tests of the lenses were performed at the ESRF in Grenoble, France. First lenses showed a gain in the range of 20, a full width at half maximum of the focal spot intensity of approximately 2 lm to 3 lm and unique radiation stability of the optical characteristics. IntroductionThe idea of refractive X-ray lenses proposed in [1] was for the first time realized in form of consecutive holes in an aluminum block [2]. Unlike in case of visible light such an X-ray lens has to be composed of several elements with a concave shape. Their radius of curvature is in the range of several hundreds down to tens of micrometers. The lens material is absorbing. Since the first publication search and development of suitable materials and technologies for the formation of this simplest and cheapest type of X-ray optics is going on [3][4][5][6][7][8][9].Materials consisting of light atoms allow to reduce X-ray absorption and to increase the gain in the focal spot of an X-ray lens compared to heavier materials. Minimizing the bridge distance between adjacent concave shapes of an element of an X-ray lens leads to the same result. Besides, the exact patterning of the lens element form with the possibility of a coaxial arrangement of the elements is necessary in order to obtain the minimal size of a focal spot. A high roughness of the surface of the lens elements and a crystallinity of the lens material needs also to be avoided because it reduces the gain in the focal spot. In addition, expensive and materials unstable under X-ray exposure under normal conditions can not be used for this application. Depending on these evident limitations, planar lithographic technologies, especially deep X-ray lithography and LIGA technique would be a suitable process to pattern these elements. Structure characteristics as aspect ratios up to 100, sub-micrometer tolerance, smooth side-walls, vertical and tilted structures, sub-micrometer precision and exact positioning of the structures on a substrate are achieved by deep X-ray lithography in thick resist layers [10]. In principle, polymer X-ray resist materials composed from C, O and H atoms mainly are from the point of absorption competitive against the known lens materials as Li, Be, diamond, Al and Si. However, positive X-ray resists like PMMA which is conventional for X-ray lithography are destroyed under X-ray exposure in case of an absorbed radiation of already 1 kJ/cm 3 . This is insufficient even for a 1 h monochromatic X-ray experiment.A while ago the multi-component highly sensitive negative photo-resist SU-8 [11] was firstly proposed for deep X-ray lithography [12]. In our previous works [13,14] it has been shown that microstructures with aspect ratios of m...

show abstract

“…Several dedicated lithography beamlines and supporting laboratories have been developed throughout the world. These facilities feature a wide range of beam properties (such as radiation spectrum, beam power, beam size), various degrees of adjustability to process parameter requirements (such as spectral and power adjustment), a wide spectrum of supported mask and sample types and geometries, different supporting fabrication capabilities and in-house process standards, as well as access models (Pantenburg and Mohr 2001;Mohr et al 2004;Loechel et al 2002;Feiertag et al 1997;Guckel et al 1995;Johnson et al 1996;Aigeldinger et al 2000;Mancini et al 2002;Morales 1999;Megtert et al 2007;Jian et al 2007;Utsumi et al 2007;Namkung 1998;Chou et al 2008).…”

mentioning

confidence: 98%

Synchrotron laboratory for micro and nano devices: facility concept and design

et al. 2010

View full text Add to dashboard Cite

SyLMAND, the Synchrotron Laboratory for Micro and Nano Devices at the Canadian Light Source, is a new deep X-ray lithography facility focusing on spectral and beam power adjustability and large exposable area formats. We present the concept of the bend magnet beamline and its main components. A double disk intensity chopper offers the unique capability of continuous average beam power reduction to a range between 261 W and approximately 0.1 W without affecting the spectrum. Continuous spectral tuning between 1-2 keV and [15 keV photon energy is achieved using a double mirror system and low atomic number pre-filters. The radiation fan is more than 150 mm wide, allowing for full 6 00 wafer exposure under vacuum conditions. We furthermore describe the vacuum window concept that was required as a result of the large exposure area and broad spectral tunability.

show abstract

X-ray lenses fabricated by deep x-ray lithography

Cited by 9 publications

References 7 publications

Improvements in graphite-based X-ray mask fabrication for ultradeep X-ray lithography

Improvements in graphite-based X-ray mask fabrication for ultradeep X-ray lithography

Fabrication and preliminary testing of X-ray lenses in thick SU-8 resist layers

Synchrotron laboratory for micro and nano devices: facility concept and design

Contact Info

Product

Resources

About