2013
DOI: 10.1016/j.egypro.2013.07.302
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XIS: A Low-current, High-voltage Back-junction Back-contact Device

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Cited by 3 publications
(3 citation statements)
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“… 7 , 28 Another benefit of high-voltage modules over conventional modules is that they use lower currents, which enables the use of smaller cables and bypass diodes, thereby lowering the cost of the materials. 29 Hanifi et al. 30 and Pannebakker et al.…”
Section: Introductionmentioning
confidence: 99%
“… 7 , 28 Another benefit of high-voltage modules over conventional modules is that they use lower currents, which enables the use of smaller cables and bypass diodes, thereby lowering the cost of the materials. 29 Hanifi et al. 30 and Pannebakker et al.…”
Section: Introductionmentioning
confidence: 99%
“…Thin wafers are more flexible and fragile than thick wafers, and keener to break. An increased breakage rate can have a negative impact on the manufacturing yield and, for this reason, solutions to handle thin wafers safely during processing are currently being investigated . Among them, a widely adopted method is the bonding of the thin wafer to a thick substrate at an early stage of the cell processing.…”
Section: Introductionmentioning
confidence: 99%
“…According to the substrates and adhesives used for wafer bonding, different solar devices merging cell and module manufacturing are proposed . For instance, Imec proposes the concept of integrated‐interconnected i 2 ‐module .…”
Section: Introductionmentioning
confidence: 99%