XSIM: An Efficient Crosstalk Simulator for Analysis and Modeling of Signal Integrity Faults in both Defective and Defect-free Interconnects

Power electronic circuit simulation today has become increasingly more demanding in both the speed and accuracy. Whilst almost every simulator has its own advantages and disadvantages, co-simulations are becoming more prevalent. This paper provides an overview of the co-simulation capabilities of device-level circuit simulators. More specifically, a listing of device-level simulators with their salient features are compared and contrasted. The co-simulation interfaces between several simulation tools are discussed. A case study is presented to demonstrate the co-simulation between a device-level simulator (PSIM) interfacing a system-level simulator (Simulink), and a finite element simulation tool (FLUX). Results demonstrate the necessity and convenience as well as the drawbacks of such a comprehensive simulation.

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Self-Repair Technology for Global Interconnects on SoCs

Scheit

Vierhaus

Design and Test Technology for Dependable Systems-on-Chip

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The reliability of interconnects on ICs has become a major problem in recent years, due to the rise of complexity, low-k-insulating material with reduced stability, and wear-out-effects due to high current density. The total reliability of a system on a chip is more and more dependent on the reliability of interconnects. The growing volume of communication due to the increasing number of integrated functional units is the main reason. Articles have been published, which predict that static faults due to wear-out effects will occur more often. This will harm the reliability and decrease the mean-time-to-failure. Most of the published techniques are aimed at the correction of transient faults. Built-in self-repair has not been discussed as much as the other techniques. In this chapter, the authors will provide an overview over the state of the art for fault-tolerant interconnects. They will discuss the use of built-in self repair in combination with other approved solutions. The combination is a promising way to deal with all kinds of faults.

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XSIM: An Efficient Crosstalk Simulator for Analysis and Modeling of Signal Integrity Faults in both Defective and Defect-free Interconnects

Cited by 3 publications

References 4 publications

Transient analysis of crosstalk coupling between high-speed carbon nanotube interconnects

Transient analysis of crosstalk coupling between high-speed carbon nanotube interconnects

Co-Simulation Interfacing Capabilities in Device-Level Power Electronic Circuit Simulation Tools: An Overview

Self-Repair Technology for Global Interconnects on SoCs

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