2015
DOI: 10.1016/j.solmat.2015.07.040
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“Zero-charge” SiO2/Al2O3 stacks for the simultaneous passivation of n+ and p+ doped silicon surfaces by atomic layer deposition

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Cited by 26 publications
(15 citation statements)
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“…He reported SRVs ∼3.6 cm s −1 on 2–3 Ωcm n‐type silicon. The mechanisms of passivation were similar to those on single AlO x layer, with the advantage that the negative charge built at the SiO x /AlO x interface exceeds the positive charge at the SiO x /Si interface, making this structure suitable to passivate n‐type and p‐type silicon surface simultaneously .…”
Section: Materials and Methods For Silicon Surface Passivationmentioning
confidence: 90%
“…He reported SRVs ∼3.6 cm s −1 on 2–3 Ωcm n‐type silicon. The mechanisms of passivation were similar to those on single AlO x layer, with the advantage that the negative charge built at the SiO x /AlO x interface exceeds the positive charge at the SiO x /Si interface, making this structure suitable to passivate n‐type and p‐type silicon surface simultaneously .…”
Section: Materials and Methods For Silicon Surface Passivationmentioning
confidence: 90%
“…15,16 Interestingly, ALD SiO 2 /Al 2 O 3 stacks have also emerged as an alternative passivation scheme for n þ Si. 17 The ALD SiO 2 /Al 2 O 3 stacks do not exhibit a high negative Q f , as a sufficiently thick SiO 2 layer prevents the injection of electrons from the c-Si bulk into the Al 2 O 3 . 18 Moreover, the stack provides excellent levels of chemical passivation with D it <10 11 eV -1 cm -2 ; it can be deposited at low temperatures and with a high conformality over surfaces with high roughness.…”
mentioning
confidence: 99%
“…Note that a SiO 2 thickness of 4-5 nm has proven to be sufficient for optimized passivation of n þ Si in previous work. 17 Immediately after deposition of SiO 2 , the Al 2 O 3 capping layer was deposited without vacuum break. Next, the samples received a postdeposition anneal at 400 C in N 2 ambient for 10 min.…”
mentioning
confidence: 99%
“…[28], [29] Therefore, in particular excellent chemical passivation of the rear surface of IBC cells is preferred to avoid surface recombination at these regions near the pn-junction. In this work, it was found that significant pn-recombination could avoided when using the Al 2 O 3 /SiN x passivation scheme.…”
Section: Results On Mercury Solar Cellsmentioning
confidence: 99%