2011
DOI: 10.1109/led.2011.2147754
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Zero-Mask Contact Fuse for One-Time-Programmable Memory in Standard CMOS Processes

Abstract: This letter describes the formation of one-timeprogrammable (OTP) memory using standard contact fuse and polysilicon diode in a standard CMOS technology. Programming of the contact fuse is achieved by applying a high current pulse to destroy the contact. Compared with other existing OTP technologies, the proposed approach has the advantage of zero additional mask, no additional processing step, compact structure, and low programming voltage. The described OTP has been demonstrated in a 0.18-μm CMOS technology … Show more

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Cited by 23 publications
(9 citation statements)
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“…While we maintain the use of scan chains in the design, we assume that they have been disabled through use of a fuse mechanism. The implementation of fuses has been previously demonstrated and widely used in practice [18], [19]. While additional side channel techniques may augment an attacker's capabilities [20], we consider these to be outside the scope of the paper.…”
Section: A Attacker Modelmentioning
confidence: 99%
“…While we maintain the use of scan chains in the design, we assume that they have been disabled through use of a fuse mechanism. The implementation of fuses has been previously demonstrated and widely used in practice [18], [19]. While additional side channel techniques may augment an attacker's capabilities [20], we consider these to be outside the scope of the paper.…”
Section: A Attacker Modelmentioning
confidence: 99%
“…Therefore, a change in the key requires modifying the mask layout. Efuse [1] and anti-fuse [2,3] are one-time programmable (OTP) memories, which can be built in a generic digital process, but the programming operation is irreversible. A battery-backed SRAM is a power-gated SRAM in data retention mode.…”
Section: Introductionmentioning
confidence: 99%
“…It changes in gate material, finshape bulk and lack of an RPO layer reduce the scalability of the logic-compatible RRAM mentioned above. [19][20][21][22] As a result, novel structures for the 3D FinFET process are needed to develop fully compatible NVM cells.…”
Section: Introductionmentioning
confidence: 99%