The mechanical strength of silicon wafers of 100 µm thickness was studied. Loading of the
wafers was carried out by the “ring-on ring” method, stress and deflection under the small ring
were determined by finite element modeling. The validity of the calculation model was checked
by comparing the dependences of the deflection under the small ring on the load obtained in the
experiment and by the simulation. The effect of methods of wafers obtaining and their surface
treatment on the strength, as well as the connection between the strength and surface roughness
characteristics were shown.