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A multifunctional scanning probe microscope (SPM) will be described that transparently integrates with a Dual Beam SEM/FIB System. This is done without perturbing any of the capabilities of the Dual Beam in terms of detectors, gas injectors, analyzers etc while allowing for a completely exposed probe tip to be imaged online even with immersion objectives at working distances as short as 4 mm.In addition, the completely free motion of the rotation axis of the stage is maintained with the probe tip at the eucentric point, which makes it possible to orient the sample in any direction on any structure. The X and Y scan range of the atomic force microscopic (AFM) imaging achieves 35 microns with rough motion over 10 millimeters. This permits the SPM to tilt into position perpendicular to the SEM or FIB or under an angle for rapid and accurate placement of the probe tip at or on structures such as biopolymeric materials that are nanometric in X, Y and Z extent. Thus, not only can a structure's nanometric height be accurately profiled but this can be accomplished with the online excellence of SEM for X, Y metrology. Furthermore, electron and ion beam sensitive samples can be imaged and characterized by AFM at high resolution.Of special importance for online focused ion beam (FIB) fabrication is the Z extent of the AFM which is an unprecedented 35 microns. The design also allows placing the probe tip with an orientation facing up for fabrication or facing down for imaging.An additional integral part of the design is electron/ion beam friendly probes with unique characteristics. The functional capabilities of these probes will be described. All such probes are slender, long (>60 microns) with an axial ratio that can be as high as 10:1. All such probes designed for this combination of SPM with SEM/FIB have highly exposed probe tips. This, combined with the Z extent of the AFM imaging provides deep trench capabilities especially important for FIB fabrication. The system allows for standard imaging modalities such as elasticity and data on the relative elasticity of copper on silicon is shown below and will be presented.Within the class of probes that have been implemented with SEM are probes for nanometric optical nearfield imaging (NSOM) and data on GaN wires excited by electron beams will be shown as part of this presentation. Other functionalities existing for such probes exist such as thermal, magnetic and electrical.Such a combination of SPM with the Dual Beam capabilities of SEM/FIB is in effect a new form of analytical instrument which portends to be a disruptive technology affecting the potential of 640

Scanning electron microscopy (SEM) and ion beam milling (FIB) techniques are mature nanoscale measurement technologies, while Atomic Force Microscopy (AFM) is a developing technology with intense interest in the scientific community for basic research and development. We discuss the recent integration of these techniques into a single instrument enabled by technological innovation in AFM instrument design, and applications of this instrument for characterization of FIB milled trenches.An AFM integrated into the SEM/FIB has specific design constraints that need to be met involving the AFM scanner, probe design, and feedback loop so that it geometrically fits into the chamber without interfering with the electron and ion beams. An ultraflat scanning stage was thus developed for precise sample motion that enable large ranges (85 microns or greater) in x,y, z. SPM probes that do not interfere with the electron beam were manufactured from fused silica in a cantilevered geometry (see Fig 1) where there is full visualization of the tip, without any loss of SPM functionality. These probes are combined with a tuning fork based feedback mechanism to maintain accurate tip-sample control; this mechanism does not involve lasers or optical beam deflection that interferes with the electron and ion beams.The many benefits of this combined approach to three-dimensional nanoscale characterization are illustrated in the imaging of a FIB milled trench. Figure 2, left shows an AFM image profiling a 25 μm-deep trench milled in silicon with FIB imaged with the large Z range of the system. In this measurement, the FIB beam was used to mill this feature, and it was followed immediately by AFM imaging without having to remove the specimen from the FIB chamber and search in the AFM. Furthermore, the true depth of the trench was measured by the AFM in a cross-sectional profile ( Figure 2, middle) while a 3D reconstruction revealed the geometry of the sidewall (Figure 2, right). Sidewall imaging with such long and exposed tips now are feasible with this instrument. The red arrow in this image clearly shows a Pt decoration on this structure, and the white arrow shows an undercut. Additionally, the ability of AFM to quickly and easily follow FIB milling with high Z resolution provides a straightforward and convenient method to check on FIB milling results. This capability is demonstrated in Figure 3 where several FIB-milled features in Si were monitored during the milling process. The grayscale SEM image in Figure 3 (left) can easily locate these features and measure their widths but cannot provide direct information on their depths. The AFM delivers a 3D reconstruction (Figure 3, middle), and a cross sectional profile that together provide a true topographic map of specimen features. These depth profiles demonstrate the linearity of the etching process with time.This instrument incorporates important innovations in the design and technology of atomic force microscopy enabling its integration with SEM and FIB into a single powerful capabilit...

Scanning electron microscopy (SEM) and ion beam milling (FIB) techniques are mature nanoscale measurement technologies, while Atomic Force Microscopy (AFM) is a developing technology with intense interest in the scientific community for basic research and development. We discuss the recent integration of these techniques into a single instrument enabled by technological innovation in AFM instrument design, and applications of this instrument for characterization of FIB milled trenches.An AFM integrated into the SEM/FIB has specific design constraints that need to be met involving the AFM scanner, probe design, and feedback loop so that it geometrically fits into the chamber without interfering with the electron and ion beams. An ultraflat scanning stage was thus developed for precise sample motion that enable large ranges (85 microns or greater) in x,y, z. SPM probes that do not interfere with the electron beam were manufactured from fused silica in a cantilevered geometry (see Fig 1) where there is full visualization of the tip, without any loss of SPM functionality. These probes are combined with a tuning fork based feedback mechanism to maintain accurate tip-sample control; this mechanism does not involve lasers or optical beam deflection that interferes with the electron and ion beams.The many benefits of this combined approach to three-dimensional nanoscale characterization are illustrated in the imaging of a FIB milled trench. Figure 2a shows an AFM image profiling a 25-µm-deep trench milled in silicon with FIB imaged with the large Z range of the system. In this measurement, the FIB beam was used to mill this feature, and it was followed immediately by AFM imaging without having to remove the specimen from the FIB chamber and search in the AFM. Furthermore, the true depth of the trench was measured by the AFM in a crosssectional profile (Figure 2b) while a 3D reconstruction revealed the geometry of the sidewall (Figure 2c). Sidewall imaging with such long and exposed tips now are feasible with this instrument. The red arrow in this image clearly shows a Pt decoration on this structure, and the white arrow shows an undercut. Additionally, the ability of AFM to quickly and easily follow FIB milling with high Z resolution provides a straightforward and convenient method to check on FIB milling results. This capability is demonstrated in Figure 3 where several FIB-milled features in Si were monitored during the milling process. The grayscale SEM image in Figure 3a can easily locate these features and measure their widths but cannot provide direct information on their depths. The AFM delivers a 3D reconstruction (Figure 3b), and a cross sectional profile that together provide a true topographic map of specimen features. These depth profiles demonstrate the linearity of the etching process with time.This instrument incorporates important innovations in the design and technology of atomic force microscopy enabling its integration with SEM and FIB into a single powerful capability.

Scanning electron microscopy (SEM) is a moving force in the nanotechnological revolution. Focused ion beam microscopes (FIB) have also become potent in nanotechnology and their combination with SEMs have shown the power of such on-line combinations. We describe in this paper the transparent integration in SEM/FIB of another enabling imaging & sensing technology, scanning probe microscopy (SPM). This is accomplished without affecting any detectors, injectors, analyzers or obscuring the sample stage of such twin beam systems. The transparent combination is accomplished so that the probe does not obscure the election/ion beam axis and also sits at the eucentric point. This permits the SPM to rotate into position when either the electron or ion beam is in place for standard normal operation relative to the sample surface. Such a Triple Beam TM combination is a disruptive technology affecting the potential of both electron, ion and scanned probe applications. It will be shown that it is now possible to rapidly place an SPM probe at a nanometric position within a large field of view to provide for ultrahigh resolution protocols unavailable in a SEM or FIB such as nanometric Z imaging or regions of charging in a sample. The combination effectively allows for a variety of 3D functional SPM imaging possibilities with on-line FIB material slicing. This is accomplished while allowing for deep trench profiling and side wall imaging enabled by unique SPM and probe design. Such new directions in functional understanding of materials will be discussed in this presentation while monitoring probe tip characteristics and often effectively repairing the probe tip on-line. The lack of these possibilities has limited SPM technology. A NanoTool Kit TM of electron/ion beam friendly probes with a wide spectrum of functionality will be described based on singular glass probe technology. Examples will cover on-line measurements of elasticity, electrical, thermal and even super-resolution optical imaging of cathodoluminescence and biomaterial staining. The integration described in this talk portends new directions of application in fundamental and applied science not previously accessible. 872