Copper/nickel multilayered thin-films prepared by electrodeposition have been examined in cross section by electron energy loss spectroscopy and high-resolution transmission electron microscopy. The results of the examinations provide the first direct experimental evidence of the large composition modulation across successive layers in the thin-film structure and the coherent nature of Cu/Ni interfaces.

We have studied electrochemical nucleation and growth of copper on ruthenium and ruthenium-based substrates using galvanostatic methods. We show that potential-time transients recorded during galvanostatic deposition of Cu on Ru can be used to study the effects of additives, deposition parameters, and substrate pre-treatment on Cu island density, and help determine experimental parameters needed to facilitate high island densities and quick sweep of a Cu film front across the resistive substrates.

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