Ball grid array (BGA) and chip scale package (CSP) packaging markets are increasing in the world. In general, transfer molding systems are using for these packaging process. But, transfer molding systems is difficult to change the model for high expensive metal die. Good advantage of this systems can get accuracy dimension of packaging. This paper describes a unique vacuum printing encapsulation systems (VPES) we developed to solve such problems with lower cost than transfer molding. We used matrix type BGA and CSP for this test. Matrix type BGA and CSP make easy to use printing technology at die-bonding, packaging, marking, and flax coating process. Total cost of these packaging are cheaper than transfer molding process.We developed very low warpage and high reliability epoxy resin for matrix BGA and CSP need much weight of epoxy resin than individual BGA and CSP. And it occurs very large warpage after curing. We succeed high reliability and low cost packaging systems with these technology.Index Terms-Ball grid array, chip on board, chip size packaging, large scale integrated circuit, multichip module, printing encapsulation systems, tape automated bonding, vacuum printing encapsulation systems.

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There has been studied to attain a new concept of the whole organic substrate which combines both a new aramid-paper reinforcement and a sophisticated epoxy resin. This reinforcement was based on making the mat of an organic fibre composed of an aromaticpolyether-amide and the impregnated resin of an aromatic amine-adducted epoxy of low volatile type. It must be the meaningful trend for the substrate of future copper-clad laminate to replace the past inorganic reinforcements with an organic ones, finding its way to the progressive surface-mountable use and extending its role, as the next step, to the organic multilayer hybrid-circuit, gathering all the merit of the both past organic and inorganic substrate and also removing the demerit of them accompanied with their cost reduction. So, it should be noted that we are now meeting with the dawn of the next stage of the substrate which continues to expand to both printed and hybrid circuit industry.

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