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The paper presents the results on fabrication technique of a 1,55 μm wafer-fused vertical-cavity surface-emitting lasers (VCSELs) based on the InAlGaAsP/InP optical cavity and AlGaAs/GaAs distributed Bragg reflectors (DBRs) grown by solid-source molecular beam epitaxy. The optical cavity InAlGaAsP/InP containes an active region based on multiple InGaAs quantum wells, n++/p++-In (Al)GaAs buried tunnel junction (BTJ), InGaAsP intracavity contact layers and n-InP spreading layers. The top and bottom AlGaAs/GaAs DBRs were grown on GaAs substrate, while the optical cavity InAlGaAsP/InP was grown on InP substrate. The main fabrication proceseses of 1,55 μm VCSELs such as: BTJ fabrication, dry etching of first mesa on top DBR, wet etching of second VCSEL mesa, forming of the ohmic contacts and passivation of the VCSEL structure were described in details.

A study of the technology of selective oxidation of the buried AlGaAs layer used as an aperture layer in the structure of a Vertical-cavity surface-emitting laser has been carried out. Oxidation process was made as thermal oxidating in a humidified nitrogen atmosphere. The conditions of the oxidation process are described, images of the oxidation results and the dependence of the growth rate of the oxidized layer on the process temperature are presented. A technology for the formation of an oxide current aperture has been developed for vertical cavity surface emitting lasers with a generation wavelength of 850 nm, which makes it possible to accurately control the size and shape of the resulting aperture.