A new ultramicrohardness tester for a load range between 2×10−2 and 5×10−5 N is described. The instrument is operated inside a scanning electron microscope. Load is applied and measured by means of electrical signals thus making fully automized experiments possible. Typical examples demonstrate the capability of the device and the general problem associated with ultra-low-load hardness testing. With experiments on thin films the complex situation for testing layered structures is shown and suggestions for a proper evaluation are given.

Films produced by quenching CuAg vapour onto cooled substrates at liquid nitrogen temperature are investigated using electron microscopy, electron diffraction, and electrical resistivity measurements. In the composition range from 30 to 70 at% Cu the as‐quenched films are amorphous, and within the range of 35 to 63 at% Cu the amorphous phase is stable above room temperature with a maximum crystallization temperature Tc = 381 K at 47.5 at% Cu. Crystallization results in the formation of a supersaturated f.c.c. solid solution which decomposes in a second crystallization step. The effect of deposition rate, film thickness, temperature, and surface of the substrate, and most importantly of the composition on the transition temperatures is investigated. A comparative study of the formation of amorphous phases in a wide variety of Cu‐based alloys is presented.

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