Coating the substrate with an amorphous polymer layer is a very common process in the manufacturing of integrated circuits, but the fundamental spin‐coating mechanism has not yet been precisely determined. This study examines the influence of the macromolecular characteristics on the spin‐coating process both experimentally and from a phenomenological point of view. It is concluded that the weight‐average molecular weight of the spun‐on solution is a pertinent parameter, and that chain entanglements in polymer solutions may be considered as the basic phenomenon responsible for the formation of the solid polymer layer.

Bulk resist degradation under O2 or Ar plasma exposure is experimentally demonstrated. The degradation mechanisms are analyzed in Ar plasma and a synergistic effect of ion bombardment is presented. Mechanical effects of ion bombardment lead to a surface degradation of the resist whereas thermal effects allow the extension of the degradation to the bulk. Self-diffusion of chains is demonstrated which clearly emphasizes the role of the viscoelastic properties in polymer degradation.

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