Photoacoustic imaging has shown great potential for non-invasive high-resolution deep-tissue imaging. Minimizing the optical and acoustic paths for excitation and detection could significantly increase the signal-to-noise ratio. This could be accomplished by transparent transducers permitting through-transducer illumination. However, most ultrasound transducers are not optically transparent. Capacitive micromachined ultrasound transducer (CMUT) technology has compelling properties compared to piezoelectric transducers such as wide bandwidth and high receive sensitivity. Here, we introduce transparent CMUT linear arrays with high transparency in the visible and near-infrared range. To fabricate the devices, we used an adhesive wafer bonding technique using photosensitive benzocyclobutene (BCB) as both a structural and adhesive layer with a glass-indium-tin-oxide (ITO) substrate. Silicon nitride is used as the membrane material ensuring hermiticity and optical transparency. Our fabricated transducer arrays consist of 64 and 128 elements with immersion operation frequency of 8 MHz, enabling high-resolution imaging. ITO, along with thin metal strips, are used as a conductive layer for the top electrodes with minimal impact on device transparency. Fabricated devices have shown average transparency of 70% in the visible wavelength range that goes up to 90% in the near-infrared range. Arrays are wire-bonded to interfacing electronics and connected to a research ultrasound platform for phantom imaging. Arrays exhibited signal-to-noise (SNR) of 40 dB with 30V bias voltage and laser fluence of 13.5 mJ/cm2. Arrays with 128 channels provided lateral and axial resolutions of 234 µm and 220 µm, respectively.

It has long been hypothesized that capacitive micromachined ultrasound transducers (CMUTs) could potentially outperform piezoelectric technologies. However, challenges with dielectric charging, operational hysteresis, and transmit sensitivity have stood as obstacles to these performance outcomes. In this paper, we introduce key architectural features to enable high-reliability CMUTs with enhanced performance. Typically, a CMUT element in an array is designed with an ensemble of smaller membranes oscillating together to transmit or detect ultrasound waves. However, this approach can lead to unreliable behavior and suboptimal transmit performance if these smaller membranes oscillate out of phase or collapse at different voltages. In this work, we designed CMUT array elements composed of a single long rectangular membrane, with the aim of improving the output pressure and electromechanical efficiency. We compare the performance of three different modifications of this architecture: traditional contiguous dielectric, isolated isolation post (IIP), and insulated electrode-post (EP) CMUTs. EPs were designed to improve performance while also imparting robustness to charging and minimization of hysteresis. To fabricate these devices, a wafer-bonding process was developed with near-100% bonding yield. EP CMUT elements achieved electromechanical efficiency values as high as 0.95, higher than values reported with either piezoelectric transducers or previous CMUT architectures. Moreover, all investigated CMUT architectures exhibited transmit efficiency 2–3 times greater than published CMUT or piezoelectric transducer elements in the 1.5–2.0 MHz range. The EP and IIP CMUTs demonstrated considerable charging robustness, demonstrating minimal charging over 500,000 collapse-snap-back actuation cycles while also mitigating hysteresis. Our proposed approach offers significant promise for future ultrasonic applications.

This paper reports the fabrication and characterization of the first flexible transparent capacitive micromachined ultrasound transducer (CMUT) array for through-illumination photoacoustic tomography. Fabricated based on an adhesive wafer bonding technique and a PDMS backfill approach, the array has a maximum transparency of 67% in visible light range and can be bent to a radius of curvature of less than 5 mm without the structural layers being damaged. With a center frequency of 3.5 MHz, 80% fractional bandwidth, and noise equivalent pressure (NEP) of 62 mPa/ H z , the array was successfully used in limited-view photoacoustic tomography of a 100 µm wire target, demonstrating lateral and axial resolutions of 293 µm and 382 µm, respectively, with 46 dB signal-to-noise ratio. Additionally, deep tissue photoacoustic tomography was also demonstrated on a blood tube within a chicken tissue using the fabricated CMUT arrays.

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Transparent ultrasound transducers could enable many novel applications involving both ultrasonics and optics. Recently, we reported transparent capacitive micromachined ultrasound transducers (CMUTs) and demonstrated through-illumination photoacoustic imaging. This work presents the feasibility of transparent CMUTs for combined ultrasound imaging and through-array white-light imaging with a miniature camera placed behind the array. Transparent CMUT devices are fabricated with an adhesive wafer bonding technique and provide high transparency up to 90% in visible wavelengths. Fabricated linear arrays have a central operating frequency of 9 MHz with 128 active elements. Realtime plane-wave imaging is performed for ultrasound imaging, and lateral and axial resolutions of, respectively, 234 and 338 µm are achieved. Transparent CMUT has demonstrated a high transmit sensitivity of 1.4 kPa/V per channel with a 100 VDC bias voltage. The signal-to-noise ratio for a beamformed image of wire targets is determined to be 28.4 dB. To the best of our knowledge, this is the first report of combined realtime optical and ultrasonic imaging with transparent arrays. This technology may enable one to visually see what is being scanned and scan what one sees without co-registration errors. Future applications could include multi-modality probes for interventional and surgical procedures.