No abstract

Melting and crystallization processes of lead-free and lead-contaminated alloys in near-equilibrium state were investigated. In addition, the effect of silver content up to 4 wt.% on the microstructure of Sn-Ag-Cu alloys was studied. The volume fraction of b-Sn decreased by half owing to 4 wt.% Ag content. Furthermore, contamination by lead strongly influences the properties of the solidified microstructure. The Pb grains appear as a result of two processes when the Pb content is equal to 0.5 wt.% or higher: Pb phase solidifies in the quaternary eutectic at 176°C, and Pb grains precipitate from the primary b-Sn solid solution grain during a solid state reaction. The freezing range enlarges to 51°C due to 2 wt.% Pb content owing to quaternary eutectic. Above 1 wt.% Pb content, the mechanical properties also improve due to grains of quaternary eutectic Pb and precipitated Pb grains with a size <1 lm.

The European Union and Japan initiated the issue of RoHS, the directive about the restriction of hazardous substances, which prohibits certain hazardous substances in electronic equipment - including lead - application. Due to the directive the use of lead free solder alloys is spreaded, however the Pb in the form of contamination may be appear under technological process. The lead impurity has significant effect on microstrucutre and lifetime so it is necessary to carry out detailed examinations. In this paper the study of intermetallic compounds in six-element, Pb impured, thermal cycles test-subjected, Sn-Ag-Cu (SAC) solder alloy is demonstrated

Industry should gradually replace the tin-lead solder alloys used traditionally in the soft soldering technology by lead-free soldering alloys, which raises a lot of new technological and scientific problems to be solved. The introduction and application of lead-free alloys caused a number of soldering defects not observed earlier; mechanisms of their formation are still unclear. One of such defects is whisker formation, another one is intensified formation of intermetallic phases. The appearance of undesired intermetallic phases in the soldering material spoils its mechanical properties; therefore it is particularly important that these phases do not form in electronic components. Besides, the formation of intermetallic compounds may occur in the soldering bath, thus making the soldering process difficult or even impossible.Tin-copper-nickel and tin-silver-copper alloys are suitable for the replacement of tin-lead alloys. The components of these alloys were studied. After metallographic examination of the specimens the occurrence of intermetallic phases was determined by the XRD method. The identification of intermetallic phases was carried out by using literature data and phase diagrams.

In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and Ni contents. The crack propagation was initiated by cyclic thermal shock tests with 40°C / +125°C temperature profiles. Pin misalignments relative to the bores were characterized with three attributes obtained from one section of the examined solder joints. Cracks typically originated at the solder/pin or solder/bore interfaces and propagated within the solder. It was shown that pin misalignments did not have an effect on crack propagation, thus, the solder joints' lifetime.