No abstract

The challenges posed by high chip heat fluxes and ever more stringent performance and reliability constraints make thermal management a key enabling technology in the development of microelectronic systems for the twenty‐first century. Thus, thermal packaging efforts must be performed in the context of the salient trends and parameters that characterize the IC technology and the electronic products industry. Recent road‐mapping efforts, have affirmed the expectation that improvements in CMOS semiconductor technology will continue unabated into the early part of the twenty‐first century. Exploiting the potential of this IC technology, with the attendant increase in chip size, switching speed, and transistor density, will necessitate significant improvements in packaging technology.

The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.

The extended surface literature from 1922 to 1987 is reviewed. The review begins with the classic NACA report of Harper and Brown published in 1922 and concludes with the works of Marto, Wanniarachchi, Rose, Mitrou, and Razelos published in 1986. A section entitled “The Beginnings” traces the accomplishments of the pioneers and it covers the period from 1922 to 1945 which coincides with the publication of Gardner’s landmark paper. At this point, a chronological approach is abandoned in favor of a categorization into topical areas. These are the elimination of the Murray–Gardner assumptions, boiling and condensation, experimental endeavors, compact heat exchangers, internally finned configurations, numerical analyses, optimizations, analyses of finned arrays, and additional topics including the use of extended surface to augment heat transfer, heat transfer in electrical and electronic equipment, purely mathematical techniques, and heat and mass transfer.

This is a valuable book giving a good overview as well as a state-of-the-art account of several topics related to thermal aspects of electronic packaging. Chapter I, by Nakayama, is entitled: "Thermal Management of Electronic Equipment: A Review of Technology and Research Topics." The role of heat transfer engineering and fundamental research, toward establishing design criteria are discussed. An exposition of natural convection, forced convection and advanced schemes of cooling follows. An interesting account of the heat load in Japanese computers caps up the section. Yovanovich and Antonetti wrote the next Section on the application of thermal contact resistance theory to electronic packages. The study surveys mechanical joints and the role of surface roughness, crucial, for example, to the performance of various electrical connectors. Direct air cooling of electronic components is discussed by Moffat and Ortega under two major headings, 1. Forced Convection and II. Natural Convection. Analytical and numerical methods, and experimental data are presented in the first part.