In this paper, teleoperated 3D microassembly of spherical objects with haptic feedback is presented. A dualtip gripper controlled through a haptic interface is used to pick-and-place microspheres (diameter: 4 − 6µm). The proposed approach to align the gripper with the spheres is based on a userdriven exploration of the object to be manipulated. The haptic feedback is based on amplitude measurements from cantilevers in dynamic mode. That is, the operator perceives the contact while freely exploring the manipulation area. The data recorded during this exploration are processed online and generate a virtual guide to pull the user to the optimum contact point, allowing correct positioning of the dual tips. A preliminary scan is not necessary to compute the haptic feedback, which increases the intuitiveness of our system. For the pick-and-place operation, two haptic feedback schemes are proposed to either provide users with information about microscale interactions occurring during the operation, or to assist them while performing the task. As experimental validation, a two-layer pyramid composed of four microspheres is built in ambient conditions.

Abstract-This paper presents a review of the major haptic feedback teleoperation systems for micromanipulation. During the last decade, the handling of micrometer-sized objects has become a critical issue. Fields of application from material science to electronics demonstrate an urgent need for intuitive and flexible manipulation systems able to deal with small-scale industrial projects and assembly tasks. Two main approaches have been considered: fully automated tasks and manual operation. The first one require fully pre determined tasks, while the later necessitates highly trained operators. To overcome these issues the use of haptic feedback teleoperation where the user manipulates the tool through a joystick whilst feeling a force feedback, appears to be a promising solution as it allows high intuitiveness and flexibility. Major advances have been achieved during this last decade, starting with systems that enable the operator to feel the substrate topology, to the current state-of-the-art where 3D haptic feedback is provided to aid manipulation tasks. This paper details the major achievements and the solutions that have been developed to propose 3D haptic feedback for tools that often lack 3D force measurements. The use of virtual reality to enhance the immersion is also addressed. The strategies developed provide haptic feedback teleoperation systems with a high degree of assistance and for a wide range of micromanipulation tools. Based on this expertise on haptic for micromanipulation and virtual reality assistance it is now possible to propose microassembly systems for objects as small as 1 to 10 micrometers. This is a mature field and will benefit small-scale industrial projects where precision and flexibility in microassembly are required.Note to Practitioners-This paper is motivated by the urgent need of intuitive and flexible manipulation systems able to deal with assembly tasks on the microscale. A new and promising solution is presented here; teleoperation with force feedback, where an operator uses a joystick to control the tool at the microscale, while experiencing interaction forces between the tool and the environment. Feedback assistance to the user using attractive and repulsive force fields is also be proposed to help achieve the assembly task. Examples are given in this paper to illustrate this approach. The presented techniques can be readily applied to most micromanipulation systems to perform advanced microassembly tasks.

Microfluidic electrical impedance flow cytometry is now a well-known and established method for single-cell analysis. Given the richness of the information provided by impedance measurements, this non-invasive and label-free approach...