The dose (fluence) of 200-keV boron, phosphorous, and antimony ions required to produce a continuous amorphous layer in silicon is determined as a function of target temperature. EPR measurements are used to monitor the process which is also then related to annealing effectiveness. The continuous amorphous layer recrystallizes at 550°C, after which only the implanted ions within that layer are completely electrically active. Carrier concentration profiles indicate the position of the amorphous layer and allow an approximate determination of the distribution with depth of damage. At the low dose rates used, reasonable agreement with a simple model for the formation of amorphous silicon as a function of ion, temperature, and dose is obtained.
A study has been made of room‐temperature implantations of group III and group V ions into amorphous Si layers prepared by the previous implantation of Si ions into crystalline Si substrates. Neutron activation combined with anodic oxidation and HF stripping techniques was used to determine the proflies of the implanted ions for Ga71 and Sb121. Electrical evaluation of the implanted layers by Hall effect and sheet resistivity measurements in conjunction with layer removal techniques yielded profiles of the net electrically active species and the depth variation of mobility after annealing for 30 min in the temperature range 600°–900°C. The ion species studied were B11 (60–200 keV), Al27 (200 keV), Ga69&71 (140 and 280 keV), P31 (100–280 keV), As75 (280 keV), Sb121&123 (120 and 260 keV), and Bi209 (240 keV). The epitaxial regrowth of the amorphous phase at 600°C causes most of the implanted ions within this region to become electrically active and uncompensated for the ion species B, P, As, Sb, and Bi even for peak ion concentrations in excess of 1020 cm−3. For Al and Ga implants, the number of carriers was less than the number of implanted ions. The profiles obtained for these implantations into amorphous Si were compared with predictions based on the theory of Lindhard, Scharff, and Schiott.
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