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Ultra short laser pulses in the ps or fs regime are used, when high requirements concerning machining quality are demanded. However, beside the quality also the process efficiency denotes a key factor for the successful transfer of this technology into real industrial applications. Based on the ablation law, holding for ultra short pulses with moderate fluences, it has been shown that the volume ablation rate can be maximized with an optimum setting of the laser parameters. The value of this maximum depends on the threshold fluence and the energy penetration depth. Both measures themselves depend on the pulse duration. For metals the dependence of the threshold fluence is well known, it stays almost constant for pulse durations up to about 10 ps and begin then to slightly increase with the pulse duration. The contrary behavior is observed for the energy penetration depth, it decreases over the whole range when the pulse duration is raised from 500 fs to 50 ps. In this paper we will show that the maximum ablation rate can therefore be increased by a factor of 1.5 to 2 when the pulse duration is reduced from 10 ps down to 500 fs.

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Laser processing with ultra-short double pulses has gained attraction since the beginning of the 2000s. In the last decade, pulse bursts consisting of multiple pulses with a delay of several 10 ns and less found their way into the area of micromachining of metals, opening up completely new process regimes and allowing an increase in the structuring rates and surface quality of machined samples. Several physical effects such as shielding or re-deposition of material have led to a new understanding of the related machining strategies and processing regimes. Results of both experimental and numerical investigations are placed into context for different time scales during laser processing. This review is dedicated to the fundamental physical phenomena taking place during burst processing and their respective effects on machining results of metals in the ultra-short pulse regime for delays ranging from several 100 fs to several microseconds. Furthermore, technical applications based on these effects are reviewed.