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The plastic deformation properties of cylindrical pre-void Aluminum-Magnesium (Al-Mg) alloy under uniaxial tension are explored using molecular dynamics simulations with embedded atom method (EAM) potential. The factors of Mg content, void size, and temperature are considered. The results show that the void fraction decreases with increasing Mg in the plastic deformation, and it is almost independent of Mg content when Mg is beyond 5%. Both Mg contents and stacking faults around the void affect the void growth. These phenomena are explained by the dislocation density of the sample and stacking faults distribution around the void. The variation trends of yield stress caused by void size are in good agreement with Lubarda model. Moreover, temperature effects are explored, the yield stress and Young's modulus obviously decrease with temperature. Our results may enrich and facilitate the understanding of the plastic mechanism of Al-Mg with defects or other alloys.

Titanium is a commonly used material in aviation, aerospace, and military applications, due to the outstanding mechanical properties of titanium and its alloys. However, its relatively low thermal conductivity restricts its extended usage. The use of graphene as a filler shows great potential for the enhancement of thermal conductivity in titanium-based metal-matrix composites (MMCs). We used classical molecular dynamics (MD) simulation methods to explore the thermal conductance at the titanium–graphene (Ti/Gr) interface for its thermal boundary conductance, which plays an important role in the thermal properties of Ti-based MMCs. The effects of system size, layer number, temperature, and strain were considered. The results show that the thermal boundary conductance (TBC) decreases with an increasing layer number and reaches a plateau at n = 5. TBC falls under tensile strain and, in turn, it grows with compressive strain. The variation of TBC is explained qualitatively by the interfacial atomic vibration coupling factor. Our findings also provide insights into ways to optimize future thermal management based on Ti-based MMCs materials.

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