The largest limitation of phase-shifting interferometry for optical testing is the sensitivity to the environment, both vibration and air turbulence. In many situations the measurement accuracy is limited by the environment and sometimes the environment is sufficiently bad that the measurement cannot be performed. Recently there have been several advances in dynamic interferometry techniques for reducing effects of vibration. This talk will describe and compare two dynamic interferometry techniques; simultaneous phase-shifting interferometry and a special form of spatial carrier interferometry utilizing a micropolarizer phase-shifting array.

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A vibration-insensitive interferometer is described to measure the thickness, refraction index and surface profile of thin-film stack at normal incidence. By satisfying the continuous boundary conditions of electric and magnetic fields at interfaces in a multilayer film stack, the reflection coefficient phase of the thin-film stack can be distinguished from the phase of spatial path difference, thus thickness and refraction index can be extracted. The experiment results showed that the measurement precision is significantly increased after the phase analysis was added into the reflectance analysis.