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Epitaxial graphene films were grown in vacuo by silicon sublimation from the (0001) and (0001) faces of 4H-and 6H-SiC. Hall effect mobilities and sheet carrier densities of the films were measured at 300 K and 77 K and the data depended on the growth face. About 40% of the samples exhibited holes as the dominant carrier, independent of face. Generally, mobilities increased with decreasing carrier density, independent of carrier type and substrate polytype. The contributions of scattering mechanisms to the conductivities of the films are discussed. The results suggest that for near-intrinsic carrier densities at 300 K epitaxial graphene mobilities will be ~150,000 cm 2 V -1 s -1 on the (0001) face and ~5,800 cm 2 V -1 s -1 on the (0001) face.

We report a direct correlation between carrier mobility and Raman topography of epitaxial graphene (EG) grown on silicon carbide (SiC). We show the Hall mobility of material on the Si-face of SiC [SiC(0001)] is not only highly dependent on thickness uniformity but also on monolayer s st tr ra ai in n uniformity. Only when both thickness and strain are uniform over a significant fraction (> 40%) of the device active area does the mobility exceed 1000 cm 2 /V-s. Additionally, we achieve high mobility epitaxial graphene (18,100 cm 2 /V-s at room temperature) on the C-face of SiC [SiC(000-1)] and show that carrier mobility depends strongly on the graphene layer stacking. These findings provide a means to rapidly estimate carrier mobility and provide a guide to achieve very high mobility in epitaxial graphene. Our results suggest that ultra-high mobilities (>50,000 cm 2 /V-s) are achievable via the controlled formation of uniform, rotationally faulted epitaxial graphene.The recent success of graphene transistor operation in the giga-hertz range has solidified the potential of this material for high speed electronic applications. 1,2 Realization of graphene technologies at commercial scales, however, necessitates large-area graphene production, as well as the ability to rapidly characterize its structural and electronic quality. Graphene films can be produced by mechanical exfoliation from bulk graphite, 3,4 reduction of graphite-oxide, 5,6 chemical vapor deposition on catalytic films, 7 or via Si-sublimation from bulk SiC substrates. 8 9, -10,11, 12 The last technique currently appears to hold the most promise for large-area electronic grade graphene, and already shows tremendous potential for high-frequency device technologies. 2 Nevertheless, precise control of the graphene electronic properties (i.e. mobility) over large areas is necessary to enable graphene-based technological applications. Realization of such control will come through an intimate understanding of the process-propertyperformance relationship and the role that graphene thickness, strain, and layer stacking plays in this relationship over very large areas up to full wafers. Of the characterization techniques used for layer thickness determination, 13 ,14,15, -16,17,18, 19 Raman spectroscopy is arguably the simplest and fastest, especially for exploring monolayer EG on SiC(0001) (referred to as EG Si )and EG layer stacking on SiC(000-1) (referred to as EG c ). [15][16][17][18][19] Characterization of EG via Raman spectroscopy requires fitting the 2D Raman peak. 15,16,20 Raman spectra of EG Si fit by one or four Lorentzian functions are characteristic of monolayer or bilayer graphene, respectively. 15 Figure 1a demonstrates layer thickness evaluation for monolayer and bilayer EG Si via Lorentzian fitting of the 2D Raman spectra. To further validate these thickness measurements, cross-sectional transmission electron microscopy (TEM) was performed (Fig. 1b,c). The TEM micrographs in Fig.1b,c include a transition layer (Layer 0), which is in dire...

We present X-ray photoelectron spectroscopy, van der Pauw Hall mobilities, low-temperature far-infrared magneto transmission (FIR-MT), and atomic force microscopy (AFM) results from graphene films produced by radiative heating in an ultrahigh vacuum (UHV) chamber or produced by radio frequency (RF) furnace annealing in a high vacuum chemical vapor deposition system on Si- and C-face 4H SiC substrates at 1200-1600 degrees C. Although the vacuum level and heating methods are different, graphene films produced by the two methods are chemically similar with the RF furnace annealing typically producing thicker graphene films than UHV. We observe, however, that the formation of graphene on the two faces is different with the thicker graphene films on the C-face RF samples having higher mobility. The FIR-MT showed a 0(-1) --> 1(0) Landau level transition with a square root B dependence and a line width consistent with a Dirac fermion with a mobility >250,000 cm(2) x V(-1) x s(-1) at 4.2 K in a C-face RF sample having a Hall-effect carrier mobility of 425 cm(2) x V(-1) x s(-1) at 300 K. AFM shows that graphene grows continuously over the varying morphology of both Si and C-face substrates.