Research has been conducted to investigate ways to make thinner, yet more cohesive TiN films. Plasma vapor deposition techniques were used in conjunction with electron cyclotron resonance to deposit TiN films on substrates of Inconel 718 (nickel-based superalloy). Previous parts of this investigation have focused on the relationship between process (i.e., film deposition) parameters, film microstructure, and film mechanical properties. The final part of this study extends the research focus to discuss what effect a change in the power setting of the microwave plasma has on the resulting Meyer hardness of the TiN-coated sample. The crystal orientation and texture of these films are also discussed. Optimum hardness of greater than 46 GPa was found at low microwave power of 200 W and a substrate bias of −100 V. Lowering microwave power to 200 W more than doubled the number of (111)-oriented grains. Substrate bias of −100 V or greater resulted in a greater than twofold decrease in (200)-oriented grains.

Articles you may be interested inEffect of oxygen incorporation on structural and properties of Ti-Si-N nanocomposite coatings deposited by reactive unbalanced magnetron sputtering J. Vac. Sci. Technol. A 24, 974 (2006); 10.1116/1.2202128 Structure and mechanical properties of Ti-Si-N films deposited by combined DC/RF reactive unbalanced magnetron sputtering Establishing the relationship between process, structure, and properties of TiN films deposited by electron cyclotron resonance assisted reactive sputtering. I. Variations in hardness and roughness as a function of process parametersResearch has been conducted to investigate ways to make thinner, yet more cohesive TiN films. Physical vapor deposition techniques were used in conjunction with electron cyclotron resonance to deposit TiN films on substrates of Inconel 718. This investigation has focused on the relationship between film deposition parameter interactions, and the resulting film microstructure and mechanical response. Previous parts of this investigation have quantified the differences in Meyer hardness and grain orientation of these deposited TiN films as a function of systematically varied deposition conditions. This part of the research develops a model that explores the connection between deposition conditions, film texture, and mechanical integrity. This model describes the relationship between the triad of ͑1͒ deposition conditions, ͑2͒ texture metrics that include fractal exponent, crystal orientation, and grain size, and ͑3͒ mechanical response, as measured by Meyer hardness and root-mean-square roughness.

Research has been conducted to investigate process control methods to make thinner, yet more cohesive TiN films. An electron cyclotron resonance plasma enhanced reactive sputtering technique was used to deposit TiN films of 1–2 μm thickness on Inconel 718 substrates. A designed experiment was conducted to identify which processing parameters, single or coupled, had significant effects upon the film microstructure and mechanical properties. It was found that Meyer hardness and root mean square (rms) roughness can be changed by varying the deposition conditions of system pressure, substrate temperature, nitrogen flow, and substrate bias. While it was determined that substrate temperature and substrate bias caused a variation in rms roughness, it was found that the interaction of system pressure and substrate temperature had a stronger effect. While system pressure was shown to have a strong effect on hardness, the interaction of system pressure and nitrogen flow caused a greater variation.