Impact of ultrathin transition metal buffer layers on Fe 3 O 4 thin films J. Appl. Phys. 107, 09B101 (2010); 10.1063/1.3350910 CPP transport properties of polycrystalline Fe 3 O 4 thin films sputtered on Cu underlayers J. Appl. Phys. 97, 10C315 (2005); 10.1063/1.1847191Fabrication and magnetoresistive effect of current perpendicular to plane devices using half-metallic Fe 3 O 4 thin films on metallic films
Amorphous silicon (a-Si) was crystallized by metal-induced crystallization (MIC) using a Ni standard absorption solution. The a-Si films spin-coated with a 5000 ppm Ni solution were crystallized at as low as 500 °C. Needlelike morphology, developed as a result of the migration of NiSi2 precipitates, appears in the MIC poly-Si. The growth of the needlelike crystallites proceeds to a direction parallel to 〈111〉. The a-Si can be fully crystallized at 500 °C for 20 h.
A new fabrication process
for polycrystalline silicon (poly-Si) thin-film transistors (TFTs)
on glass substrate is reported.
Amorphous silicon (a-Si) was crystallized
by metal-induced crystallization (MIC)
using a Ni solution for low-temperature crystallization.
The a-Si film spin-coated
with a 5000 ppm Ni solution
was fully crystallized at 500°C.
The poly-Si TFT made of the poly-Si
exhibited a field-effect mobility of 105 cm2/Vs
and a threshold voltage of -4 V.
The high performance of the poly-Si TFT
appears to be due to the absence of intragrain microdefects in the poly-Si,
which is confirmed
from the plane-view TEM image.
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