In integrated photonics, specific wavelengths are preferred such as 1550 nm due to low-loss transmission and the availability of optical gain in this spectral region. For chip-based photodetectors, layered two-dimensional (2D) materials bear scientific and technologicallyrelevant properties such as electrostatic tunability and strong light-matter interactions. However, no efficient photodetector in the telecommunication C-band has been realized with 2D transition metal dichalcogenide (TMDCs) materials due to their large optical bandgap. Here, we demonstrate a MoTe2-based photodetector featuring strong photoresponse (responsivity = 0.5 A/W) operating at 1550 nm on silicon micro ring resonator enabled by strain engineering of the transition-metal-dichalcogenide film. We show that an induced tensile strain of ~4% reduces the bandgap of MoTe2, resulting in large photo-response in the telecommunication wavelength, in otherwise photo-inactive medium when unstrained. Unlike Graphene-based photodetectors relying on a gapless band structure, this semiconductor-2D material detector shows a ~100X improved dark current enabling an efficient noise-equivalent power of just 90 pW/Hz 0.5 . Such strain-engineered integrated photodetector provides new opportunities for integrated optoelectronic systems.

Photodetectors converting light signals into detectable photocurrents are ubiquitously in use today. To improve the compactness and performance of next-generation devices and systems, low dimensional materials provide rich physics to engineering the light–matter interaction. Photodetectors based on two-dimensional (2D) material van der Waals heterostructures have shown high responsivity and compact integration capability, mainly in the visible range due to their intrinsic bandgap. The spectral region of near-infrared (NIR) is technologically important, featuring many data communication and sensing applications. While some initial NIR 2D material-based detectors have emerged, demonstrations of doping-junction-based 2D material photodetectors with the capability to harness the charge-separation photovoltaic effect are yet outstanding. Here, we demonstrate a 2D p-n van der Waals heterojunction photodetector constructed by vertically stacking p-type and n-type indium selenide (InSe) flakes. This heterojunction charge-separation-based photodetector shows a threefold enhancement in responsivity in the NIR spectral region (980 nm) as compared to photoconductor detectors based on p- or n-only doped InSe. We show that this junction device exhibits self-powered photodetection operation, exhibits few pA-low dark currents, and is about 3–4 orders of magnitude more efficient than the state-of-the-art foundry-based devices. Such capability opens doors for low noise and low photon flux photodetectors that do not rely on external gain. We further demonstrate millisecond response rates in this sensitive zero-bias voltage regime. Such sensitive photodetection capability in the technologically relevant NIR wavelength region at low form factors holds promise for several applications including wearable biosensors, three-dimensional (3D) sensing, and remote gas sensing.

Layered two-dimensional (2D) materials provide a wide range of unique properties as compared to their bulk counterpart, making them ideal for heterogeneous integration for on-chip interconnects. Hence, a detailed understanding of the loss and index change on Si integrated platform is a prerequisite for advances in opto-electronic devices impacting optical communication technology, signal processing, and possibly photonic-based computing. Here, we present an experimental guide to characterize transition metal dichalcogenides (TMDs), once monolithically integrated into the Silicon photonic platform at 1.55 µm wavelength. We describe the passive tunable coupling effect of the resonator in terms of loss induced as a function of 2D material layer coverage length and thickness. Further, we demonstrate a TMD-ring based hybrid platform as a refractive index sensor where resonance shift has been mapped out as a function of flakes thickness which correlates well with our simulated data. These experimental findings on passive TMD-Si hybrid platform open up a new dimension by controlling the effective change in loss and index, which may lead to the potential application of 2D material based active on chip photonics.

With the increasing need for large volumes of data processing, transport, and storage, optimizing the trade-off between high-speed and energy consumption in today’s optoelectronic devices is getting increasingly difficult. Heterogeneous material integration into silicon- and nitride-based photonics has showed high-speed promise, albeit at the expense of millimeter-to centimeter-scale footprints. The hunt for an electro-optic modulator that combines high speed, energy efficiency, and compactness to support high component density on-chip continues. Using a double-layer graphene optical modulator integrated on a Silicon photonics platform, we are able to achieve 60 GHz speed (3 dB roll-off), micrometer compactness, and efficiency of 2.25 fJ/bit in this paper. The electro-optic response is boosted further by a vertical distributed-Bragg-reflector cavity, which reduces the driving voltage by about 40 times while maintaining a sufficient modulation depth (5.2 dB/V). Modulators that are small, efficient, and quick allow high photonic chip density and performance, which is critical for signal processing, sensor platforms, and analog- and neuromorphic photonic processors.

Strain engineering offers unique control to manipulate the electronic band structure of two-dimensional (2D) materials, resulting in an effective and continuous tuning of the physical properties. Ad hoc straining of 2D materials has demonstrated state of the art photonic devices including efficient photodetectors at telecommunication frequencies, enhancedmobility transistors, and on-chip single photon sources, for example. However, in order to gain insights into the underlying mechanism required to enhance the performance of the next-generation devices with strain(op)tronics, it is imperative to understand the nano-and microscopic properties as a function of a strong nonhomogeneous strain. Here, we study the strain-induced variation of local conductivity of a few-layer transition metal dichalcogenide using conductive atomic force microscopy. We report a strain characterization technique by capturing the electrical conductivity variations induced by local strain originating from surface topography at the nanoscale, which allows overcoming limitations of existing optical spectroscopy techniques. We show that the conductivity variations parallel the strain deviations across the geometry predicted by molecular dynamics simulation. These results substantiate a variation of the effective mass and surface charge density by 0.026m e and 0.03e for every percent of uniaxial strain, respectively, derived using band structure calculation based on the first-principles density functional theory. Furthermore, we demonstrate modulation of the effective Schottky barrier height by quantifying its alteration originating from a gradual reduction of the conduction band minima as a function of tensile strain. Such spatially textured electronic behavior via surface topography-induced strain variations in atomisticlayered materials at the nanoscale opens up exciting opportunities to control fundamental material properties and offers a myriad of design and functional device possibilities, such as for electronics, nanophotonics, flextronics, or smart cloths.