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Cellulose nanopaper (CNP) made of cellulose nanofibrils (CNF) has gained extensive attention in recent years for its lightweight and superior mechanical properties alongside sustainable and green attributes. The mechanical characterization studies on CNP at the moment have generally been limited to tension tests. In fact, thus far there has not been any report on crack initiation and growth behavior, especially under dynamic loading conditions. In this work, crack initiation and growth in self-assembled CNP, made from filtration of CNF suspension, are studied using a full-field optical method. Dynamic crack initiation and growth behaviors and time-resolved fracture parameters are quantified using Digital Image Correlation (DIC) technique. The challenge associated with dynamic loading of a thin strip of CNP has been overcome by an acrylic holder with a wide pre-cut slot bridged by edge-cracked CNP. The ultrahigh-speed digital photography is implemented to map in-plane deformations during pre-and post-crack initiation regimes including dynamic crack growth. Under stress wave loading conditions, macroscale crack growth occurs at surprisingly high-speed (600-700 m/s) in this microscopically fibrous material. The measured displacement fields from dynamic loading conditions are analyzed to extract stress intensity factors (SIF) and energy release rate (G) histories. The results show that the SIF at crack initiation is in the range of 6-7 MPa(m) 1/2 , far superior to many engineering plastics. Furthermore, the measured values increase during crack propagation under both low-and high-strain rates, demonstrating superior fracture resistance of CNP valuable for many structural applications.

Shape and surface topography evaluation from measured orthogonal slope/gradient data is of considerable engineering significance since many full-field optical sensors and interferometers readily output such a data accurately. This has applications ranging from metrology of optical and electronic elements (lenses, silicon wafers, thin film coatings), surface profile estimation, wave front and shape reconstruction, to name a few. In this context, a new methodology for surface profile and stress field determination based on a recently introduced non-contact, full-field optical method called digital gradient sensing (DGS) capable of measuring small angular deflections of light rays coupled with a robust finite-difference-based least-squares integration (HFLI) scheme in the Southwell configuration is advanced here. The method is demonstrated by evaluating (a) surface profiles of mechanically warped silicon wafers and (b) stress gradients near growing cracks in planar phase objects.

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