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A novel high strain rate microforming technique, laser impact liquid flexible embossing (LILFE), which uses laser induced shock waves as an energy source, and liquid as a force transmission medium, is proposed by this paper in order to emboss three-dimensional large area micro arrays on metallic foils and to overcome some of the defects of laser direct shock microembossing technology. The influences of laser energy and workpiece thickness on the deformation characteristics of the pure copper foils with the LILFE process were investigated through experiments and numerical simulation. A finite element model was built to further understand the typical stages of deformation, and the results of the numerical simulation are consistent with those achieved from the experiments. The experimental and simulation results show that the forming accuracy and depth of the embossed parts increases with the increase in laser energy and decrease in workpiece thickness. The thickness thinning rate of the embossed parts increases with the decrease of the workpiece thickness, and the severest thickness thinning occurs at the bar corner region. The experimental results also show that the LILFE process can protect the workpiece surface from being ablated and damaged, and can ensure the surface quality of the formed parts. Besides, the numerical simulation studies reveal the plastic strain distribution of embossed microfeatures under different laser energy.

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