The effect of Cu added eutectic Sn–9Zn solder reacting with the Ag substrate has been investigated in this study. Three Ag–Zn intermetallic compounds (IMCs), ∈–AgZn3, γ–Ag5Zn8, and ζ–AgZn, were formed on the Sn–9Zn/Ag interface at 260 °C. While Cu was gradually added to the Sn–9Zn alloy, microstructures of intermetallic compounds changed dramatically. The intermetallic compound microstructures became loose and Sn and Cu atoms in the Ag-Zn intermetallic compounds increased. If more than 3 wt% of Cu was added to the Sn-9Zn alloy, Ag-Sn intermetallic compounds were formed on the Ag surface and massive spalling of Ag–Zn IMC layers from the Ag surface occurred in a short reaction time.

The phase equilibria of the Sn-Cu-Au ternary, Ag-Sn-Cu-Au quaternary systems and interfacial reactions between Sn-Cu alloys and Au were experimentally investigated at specific temperatures in this study. The experimental results indicated that there existed three ternary intermetallic compounds (IMCs) and a complete solid solubility between AuSn and Cu 6 Sn 5 phases in the Sn-Cu-Au ternary system at 200°C. No quaternary IMC was found in the isoplethal section of the Ag-Sn-Cu-Au quaternary system. Three IMCs, AuSn, AuSn 2 , and AuSn 4 , were found in all couples. The same three IMCs and (Au,Cu)Sn/ (Cu,Au) 6 Sn 5 phases were found in all Sn-Cu/Au couples. The thickness of these reaction layers increased with increasing temperature and time. The mechanism of IMC growth can be described by using the parabolic law. In addition, when the reaction time was extended and the Cu content of the alloy was increased, the AuSn 4 phase disappeared gradually. The (Au, Cu)Sn and (Cu , Au) 6 Sn 5 layers played roles as diffusion barriers against Sn in Sn-Cu/Au reaction couple systems.

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