To improve the dielectric properties of sputter-deposited hafnium oxide (HfO2) films, the supercritical CO2 (SCCO2) fluid technology is introduced as a low temperature treatment. The ultrathin HfO2 films were deposited on p-type (100) silicon wafer by dc sputtering at room temperature and subsequently treated with SCCO2 fluids at 150°C to diminish the traps in the HfO2 films. After SCCO2 treatment, the interfacial parasitic oxide between the Si substrate and HfO2 layer is only about 5Å, and the oxygen content of the HfO2 films apparently increased. From current-voltage (I-V) and capacitance-voltage (C-V) measurements, the leakage current density of the SCCO2-treated HfO2 films is repressed from 10−2to10−7A∕cm2 at electric field=3MV∕cm due to the reduction of traps in the HfO2 films. The equivalent oxide thickness also obviously decreased. Besides, the efficiency of terminating traps is relative to the pressure of the SCCO2 fluids.

A low-temperature method, supercritical CO2 fluid (SCF) technology, is proposed to improve the dielectric properties of ultrathin hafnium oxide (HfO2) film at 150°C without significant formation of parasitic oxide at the interface between HfO2 and Si substrate. In this research, the HfO2 films were deposited by dc sputter at room temperature and post-treated by SCF which is mixed with 5vol% propyl alcohol and 5vol% H2O. From high-resolution transmission electron microscopy image, the interfacial oxide of SCF-treated HfO2 film is only 5Å thick. Additionally, the enhancements in the qualities of sputter-deposited HfO2 film after SCF process are exhibited by x-ray photoelectron spectroscopy and capacitance-voltage (C-V) measurement.

Low-temperature supercritical fluid (SCF) technology is employed to improve the dielectric characteristics of metal oxide film deposited at low temperature. In this investigation, hafnium oxide (HfO2) film was sputter deposited at room temperature and post-treated with SCF at 150°C, replacing typical high-temperature annealing process. From Fourier transformation infrared and thermal desorption spectroscopy measurement, the absorption peaks of Hf–O–Hf bonding and the oxygen content in HfO2 film have, respectively, shown apparent raise. The leakage current density of the low-temperature deposited HfO2 film is reduced significantly, and the conduction mechanism is modified from trap-assisted quantum tunneling to thermionic emission process, since SCF treatment effectively reduces the number of traps in HfO2 film.