Fe-IIIB alloy thin lms are widely used in various types of actuators. In this study, Fe-Ga, Fe-Al, Fe-In alloy thin lms are deposited on a Si(100) substrate through an ion-plating process using a dual vapor-source. The composition of the thin lms was controlled by adjusting the deposition rate of Fe to the IIIB alloys. Deposition rates of Fe and IIIB alloys were measured by using a crystal oscillator. We investigate the effect of introduced excess energy during thin lm formation. In particular, the solid solubility limits for each type of Fe-based alloy thin lms are estimated and then compared using a Darken-Gurry plot, which was derived by applying the Hume-Rothery rules concerning electronegativity and the atomic radius of elements. The ion kinetic energy and the ionization rate of the evaporated particles were measured using a Langmuir probe and a Faraday cup, respectively. In addition, a multi-grid type electrostatic ion-energy analyzer was added in the plasma to obtain the ion temperature in order to acquire more precise excess energy value. Therefore, we attempt to study and control the excess energy required for Fe-IIIB alloy thin-lm formation and the solid solubility limit. These results are expected to contribute signi cantly to Fe-IIIB alloy thin-lm formation through the ion-plating process.

No abstract

A procedure for the control of the excess energy of Ni thin film formation by the ion plating process has been studied. The excess energy of metal vapor particles is dependent not only on the kinetic energy of metal vapor ions but also on the ionization rate as the impinging rate of the ions on the substrate. A hot filament electron emitter was used to increase the ionization rate. Ni thin films were prepared using the ion plating process with a hot filament electron emitter. The excess energy introduced during the Ni thin film formation was determined by plasma diagnostics using the Langmuir probe, Faraday cup, and a multigrid analyzer (MGA) as an ion energy analyzer. The ionization rate of Ni particles (Z ＋ Ni /Z Ni ) increased with electrons emission. The hot filament electron emitter is effective in increasing the excess energy. Internal stresses in the Ni thin film were tensile in all samples. Tensile stress decreased with increasing ionization rate. Ion bombardment resulted in the enhancement of the compressive stress possibly because of the ion pinning effect.