The high usage of silver in industrial solar cells may limit the growth of the solar industry. One solution is to replace Ag with copper. A screen printable Cu paste is used herein to metallize industrial interdigitated back contact (IBC) solar cells. A novel metallization structure is proposed for making solar cells. Cu paste is applied to replace the majority of the Ag used in IBC cells as busbars and fingers. Cu paste is evaluated for use as fingers, and solar cells are made to test conversion efficiency and reliability. The Cu paste achieves comparably low resistivity, and Cu paste printed cells demonstrate similar efficiency to Ag paste printed cells, with an average efficiency of 23%, and only 4.5 mg W−1 of Ag usage. Also, the solar cells are stable and no Cu in‐diffusion is observed under damp heat (85 °C, 85% relative humidity) and thermal stress (200 °C) for 1000 h, respectively. All processes used in this study can be carried out with industrial equipment. These findings reveal a new application for Cu pastes and point to a new direction for reducing Ag utilization and cost.
We present our own Interdigitated Back Contact (IBC) technology, which was developed at ISC Konstanz and implemented in mass production with and at SPIC Solar in Xining, China, with production efficiencies of over 24%. To our knowledge, this is the highest efficiency achieved in the mass production of crystalline silicon solar cells without the use of charge-carrier-selective contacts. With an adapted screen-printing sequence, it is possible to achieve open-circuit voltages of over 700 mV. Advanced module technology has been developed for the IBC interconnection, which is ultimately simpler than for conventional double-sided contacted solar cells. In the next step, we will realize low-cost charge-carrier-selective contacts for both polarities in a simple sequence using processes developed and patented at ISC Konstanz. With the industrialisation of this process, it will be possible to achieve efficiencies well above 25% at low cost. We will show that with the replacement of silver screen-printed contacts by copper or aluminium metallisation, future IBC technology will be the end product for the PV market, as it is the best performing c-Si technology, leading to the lowest cost of electricity, even in utility-scale applications.
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