The music performance system works by identifying the emotional elements of music to control the lighting changes. However, if there is a recognition error, a good stage effect will not be able to create. Therefore, this paper proposes an intelligent music emotion recognition and classification algorithm in the music performance system. The first part of the algorithm is to analyze the emotional features of music, including acoustic features, melody features, and audio features. Then, the three kinds of features are combined together to form a feature vector set. In the latter part of the algorithm, it divides the feature vector set into training samples and test samples. The training samples are trained by using recognition and classification model based on the neural network. And then, the testing samples are input into the trained model, which is aiming to realize the intelligent recognition and classification of music emotion. The result shows that the kappa coefficient k values calculated by the proposed algorithm are greater than 0.75, which indicates that the recognition and classification results are consistent with the actual results, and the accuracy of recognition and classification is high. So, the research purpose is achieved.

The copper wire has some advantages in thermal performance, mechanical performance, and low cost, which make it can provide the lowest cost flip-chip(FC) package for low I/O density device. The 2D Cu stud bump finite element model was set up by using ANSYS/LS-DYNA with LOLID162 element to dynamic simulate the Cu stud bump bonding shaping process. The stress distribution in the Cu stud bump and the pad during the bonding process were studied, and the influence of pad thickness on the stress distribution of Si chip was also analyzed. The results shows that under the bonding process the Cu bump height is mainly influenced by the bonding pressure and the top shape of the Cu bump is influenced by ultrasonic energy, the increase of pad thickness results in reducing stress concentration inside the Si chip.

In the thermal design of embedded multi-chip module (MCM), the placement of chips has a significant effect on temperature field distributing, thus influences the reliability of the embedded MCM. The thermal placement optimization of chips in embedded MCM was studied in this paper, the goal of this work is to decrease temperature and achieve uniform thermal field distribution within embedded MCM. By using ANSYS the finite element analysis model of embedded MCM was developed, the temperature field distributing was calculated. Based on genetic algorithms, chips placement optimization algorithm of embedded MCM was proposed and the optimization chips placement of embedded MCM was achieved by corresponding optimization program. To demonstrate the effectiveness of the obtained optimization chips placement, finite element analysis (FEA) was carried out to assess the thermal field distribution of the optimization chips placement in embedded MCM by using ANSYS. The result shows that without chips placement optimizing the maximum temperature and temperature difference in embedded MCM model are 87.963°C and 2.189°C respectively, by using chips placement optimization algorithm the maximum temperature drop than the original 0.583°C and the temperature difference is only 0.694°C . It turns out that the chip placement optimization approach proposed in this work can be effective in providing thermal optimal design of chip placement in embedded MCM.

Two communication cabinet finite element analysis(FEA) models with different cross-sectional structure vertical columns were set up. Based on the two communication cabinet FEA models, modal analysis was carried out by using the subspace method; the first 6 order natural frequencies and vibration modes were obtained. Harmonic response analysis was also carried out; the displacement response of the communication cabinet structure under external loading was determined. The dynamic performance comparison of the two communication cabinets with different cross-sectional structure vertical columns was performed, as a result, an effective method is provided for communication cabinet dynamic characteristic optimized design.

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