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This paper presents the first demonstration of fine pitch embedded trench RDL on glass substrates using a new family of ultra-high resolution dry film photo-sensitive polymer dielectrics and a new large area panel scale lithography tool. The specific research targets are to demonstrate multilayer RDL scaling to 1um lines and vias at >200 I/Os per mm of die edge for 2.5D interposers and high density fan-out packages.