In this work, we propose a compensated temperature pressure sensor fabricated on compound LiNbO 3 /Quartz/Quartz substrates obtained by Au/Au bonding at room temperature and double face lapping/polishing of LiNbO 3 /Quartz stack and a final gold bonding with a structured Quartz wafer. This paper shows the possibility to obtain device which is intrinsically low sensitive to thermal effects, and even allowing a second order compensation thanks to the Quartz thermal stability Sensitivity of the final sensor to bending moments then is tested and results show pressure sensitivity of such devices.
In this paper, we propose a novel approach for HBAR devices using the Smart Cut TM technology to obtain thin homogeneous X-cut single crystal films of LiNb03• Sub-micron layers were successfully transferred onto LiNb03 handle wafers.RF characterizations were performed around 1.95 GHz and quality factors in excess of 40 000 are extracted, proving the applicability of layer transfer by Smart Cut TM to acoustic devices. An excellent matching between simulations and experimental data as well as TCF measurements are presented in this paper.
In this paper, we present new results on the development of piezoelectric transducers based on periodically poled ferroelectrics domains. The fabrication of test devices operating in the range 50 -500 MHz has been achieved. Pure longitudinal modes are excited, yielding high frequency operation of test devices with easily achievable lithography process (20 and 10 µm periods). The dispersion analysis of our devices is reported and the capability of the proposed waveguide to support pure longitudinal modes along the plate radial dimension is emphasized
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