This paper describes the implementation of the IBM POWER6e microprocessor, a two-way simultaneous multithreaded (SMT) dual-core chip whose key features include binary compatibility with IBM POWER5e microprocessor-based systems; increased functional capabilities, such as decimal floating-point and vector multimedia extensions; significant reliability, availability, and serviceability enhancements; and robust scalability with up to 64 physical processors. Based on a new industry-leading highfrequency core architecture with enhanced SMT and driven by a high-throughput symmetric multiprocessing (SMP) cache and memory subsystem, the POWER6 chip achieves a significant performance boost compared with its predecessor, the POWER5 chip. Key extensions to the coherence protocol enable POWER6 microprocessor-based systems to achieve better SMP scalability while enabling reductions in system packaging complexity and cost.

The IBM POWER A processor is the dominant reduced instruction set computing microprocessor in the world today, with a rich history of implementation and innovation over the last 20 years. In this paper, we describe the key features of the POWER7 A processor chip. On the chip is an eight-core processor, with each core capable of four-way simultaneous multithreaded operation. Fabricated in IBM's 45-nm silicon-on-insulator (SOI) technology with 11 levels of metal, the chip contains more than one billion transistors. The processor core and caches are significantly enhanced to boost the performance of both single-threaded response-time-oriented, as well as multithreaded, throughput-oriented applications. The memory subsystem contains three levels of on-chip cache, with SOI embedded dynamic random access memory (DRAM) devices used as the last level of cache. A new memory interface using buffered double-data-rate-three DRAM and improvements in reliability, availability, and serviceability are discussed.

The POWER8i processor is the latest RISC (Reduced Instruction Set Computer) microprocessor from IBM. It is fabricated using the company's 22-nm Silicon on Insulator (SOI) technology with 15 layers of metal, and it has been designed to significantly improve both single-thread performance and single-core throughput over its predecessor, the POWER7 A processor. The rate of increase in processor frequency enabled by new silicon technology advancements has decreased dramatically in recent generations, as compared to the historic trend. This has caused many processor designs in the industry to show very little improvement in either single-thread or single-core performance, and, instead, larger numbers of cores are primarily pursued in each generation. Going against this industry trend, the POWER8 processor relies on a much improved core and nest microarchitecture to achieve approximately one-and-a-half times the single-thread performance and twice the single-core throughput of the POWER7 processor in several commercial applications. Combined with a 50% increase in the number of cores (from 8 in the POWER7 processor to 12 in the POWER8 processor), the result is a processor that leads the industry in performance for enterprise workloads. This paper describes the core microarchitecture innovations made in the POWER8 processor that resulted in these significant performance benefits.

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